Conductive adhesives for high-frequency applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 3, 1998, Pages 469-477

  Sihlbom, Rolf ^b,c   Dernevik, Markus ^d   Lai, Zonghe ^a,b   Starski, J Piotr ^a,d   Liu, Johan ^a,b  

^a IEEE

^b SWEREA IVF   (Sweden)

^c Ericsson Microwave Systems AB   (Sweden)

^d CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

ACA; FR 4 board; SEM

Indexed keywords

ADHESIVE JOINTS; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC NETWORK ANALYZERS; SOLDERED JOINTS; SUBSTRATES;

CONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 0032156376     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.725211     Document Type: Article

References (15)

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