Environmental aging effects on the durability of electrically conductive adhesive joints

International Journal of Adhesion and Adhesives

Volumn 23, Issue 3, 2003, Pages 235-250

  Xu, Shuangyan ^a   Dillard, David A ^a   Dillard, John G ^b  

^a Virginia Polytechnic Institute and State University   (United States)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

D. Durability; Double cantilever beam; Electrically conductive adhesives; Environmental aging; Fracture energy

Indexed keywords

ADHESIVES; AGING OF MATERIALS; FREE ENERGY; PRINTED CIRCUIT BOARDS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) JOINTS;

ADHESIVE JOINTS;

EID: 0038515625     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(03)00027-7     Document Type: Article

References (32)

1. Vona Jr SA, Tong QK, Kuder R, Shenfield D. Surface mount conductive adhesives with superior impact resistance. Int Symp Adv Packag Mater, Braselton, GA, USA, 1998. p. 261-7.
2. Zwolinski M.et al. Electrically conductive adhesives for surface mount solder replacement. IEEE Trans Components, Packag, Manuf Technol, Part C. 19:1996;241-250.
3. Liu J., Gustafsson K., Lai Z., Li C. Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations. IEEE Trans Components, Packag, Manuf Technol, Part A. 20(1):1997;21-30.
4. Rorgren R., Liu J. Reliability assessment of isotropically conductive adhesive joints in surface mount applications. IEEE Trans Components, Packag, Manuf Technol, Part B. 18:1998;305-312.
5. Jagt J.C. Reliability of electrically conductive adhesive joints for surface mount applications. a summary of the state of the art IEEE Trans Components, Packag, Manuf Technol, Part A. 21:1998;215-225.
6. Dudek R., Berek H., Fritsch T., Michel B. Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism. IEEE Trans Components, Packag, Manuf Technol. 23:2000;462-469.
7. Comyn J. Polymer pereability. London: Elsevier; 1985. p. 192.
8. Lawrence SSt, Willett JL, Carriere C.J. Effect of moisture on the tensile properties of poly(hydroxy ester ether). Polymer. 42:2001;5643-5650.
9. Butkus L.M., Mathern P.D., Johnson W.S. Tensile properties and plane-stress fracture toughness of thin film aerospace adhesives. J Adhes. 66:1998;251-273.
10. Liu J, Lai Z, et al. Overview of conductive adhesive joining technology in electronics packaging applications. Proceedings of the Third International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Austin, TX, USA, 1998. p. 1-17.
11. Antoon M.K., Koenig J.L. Irreversible effects of moisture on the epoxy matrix in glass-reinforced composites. J Polym Sci: Polym Phys Ed. 19:1981;197-212.
12. Apicella A., Nicolais L., Astarita G., Orioli E. Effect of thermal history on water sorption, elastic properties and the glass transition of epoxy resins. Polymer. 20:1979;1143-1148.
13. Diamant Y., Marom G., Broutman L.J. The effect of network structure on moisture absorption of epoxy resins. J Appl Polym Sci. 26:1981;3015-3025.
14. Gledhill R.A., Kinloch A.J. Environmental failure of structural adhesive joints. J Adhes. 6:1974;315-330.
15. Venables J.D. Adhesion and durability of metal-polymer bonds. J Mater Sci. 19:1984;2431-2453.
16. Davis G.D., Whisnant P.L., Venables J.D. Subadhesive hydration of aluminum adherends and its detection by electrochemical impedance spectroscopy. J Adhes Sci Technol. 9:1995;433-442.
17. Xu S, Dillard DA. Environmental aging effects on thermal and mechanical properties of electrically conductive adhesives. J Adhes, in press.
18. Xu S, Dillard DA. Determination of impact resistance of electrically conductive adhesives using a falling wedge test, IEEE Trans Components Packag Technol, in press.
19. ASTM D638-01, Standard test method for tensile properties of plastics, annual book of ASTM standards. Pennsylvania: American Society for Testing and Materials; 2001.
20. ASTM D3433-99, Standard test method for fracture strength in cleavage of adhesives in bonded metal, annual book of ASTM standards. Pennsylvania: American Society for Testing and Materials; 1999.
21. Blackman B., Dear J.P., Kinloch A.J., Osiyemi S. The calculation of adhesive fracture energies from double-cantilever beam test specimens. J Mater Sci Lett. 10:1991;253-256.
22. Zanni-Deffarges M.P., Shanahan M.E.R. Diffusion of water into an epoxy adhesive-comparison between bulk behavior and adhesive joints. Int J Adhes Adhes. 15:1995;137-142.
23. Tyson W.R., Miller W.W. Surface free energies of solid metals. estimation from liquid surface tension measurements Surf Sci. 62:1977;267-276.
24. Kinloch AJ. Adhesion, adhesives, science and technology. London: Chapman & Hall; 1987. p. 33.
25. Owens D.K., Wendt R.C. Estimation of the surface free energy of polymers. J Appl Polym Sci. 13:1969;1741-1747.
26. Wagner CD, Riggs WM, Davis LE, Moulder JF, Muilenberg GE. Handbook of X-ray photoelectron spectroscopy, physical electronics division. Eden Prairie, MN: Perkin Elmer Corporation; 1979.
27. Jagt J.C., Beris P.J.M., Lijten G.F.C.M. Electrically conductive adhesive. a prospective alternative for SMD soldering? IEEE Trans Components, Packag, Manuf Technol, Part B. 18(2):1995;292-298.
28. James K. Reliability study of wire bonds to silver plated surfaces. IEEE Trans Parts, Hybrids, Packag. PHP-13:1997;419-425.
29. Aday J., Johnson R., Evans J., Romanczuk C. Wire bonded thick film silver multilayers for under-the-hood automotive applications. Int J Microcircuits Electron Packag. 17:1994;302-311.
30. Pinnel M.R., Bennett J.E. Mass diffusion in polycrystalline copper/electroplated gold planar couples. Metall Trans A. 3:1972;1989-1997.
31. Pinnel M.R., Bennett J.E. Qualitative observations on the diffusion of copper and gold through a nickel barrier. Metall Trans A. 7A:1976;629-635.
32. Chang C.A. Ambient dependence of the interactions in Pt/NI/Cu, and Au/Ni/Cu structures. J Mater Res. 2:1987;441-445.