Characterization and performance of electrically conductive adhesives for microwave applications

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 232-239

  Felba, J ^a   Friedel, K P ^a   Moscicki A ^b  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b Amepox Quality Silver Systems   (Poland)

Author keywords

Assembly; Band pass filters; Bonding; Conducting materials; Conductive adhesives; Electric resistance; Electronic circuits; Lead; Q factor; Silver

Indexed keywords

ADHESIVES; ASSEMBLY; BONDING; CHARACTERIZATION; COATINGS; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; FILLERS; JOINING; LEAD; MANUFACTURE; MICROSTRIP FILTERS; MICROWAVE CIRCUITS; NETWORKS (CIRCUITS); PLASTIC ADHESIVES; Q FACTOR MEASUREMENT; RECONFIGURABLE HARDWARE; SILVER;

CONDUCTING MATERIALS; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; EXPERIMENTAL DESIGN METHOD; ISOTROPICALLY CONDUCTIVE ADHESIVES; MICROSTRIP BAND-PASS FILTER; MICROWAVE APPLICATIONS; Q-FACTORS;

BANDPASS FILTERS;

EID: 84952316387     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860608     Document Type: Conference Paper

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