Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 299-302

  Ye, Lilei ^b   Lai, Zonghe ^c   Liu, Johan ^a,c   Thölén, Anders ^b  

^a IEEE

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SWEREA IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE PLASTICS; ELECTRIC CONDUCTIVITY OF SOLIDS; INTERFACES (MATERIALS); PARTICLE SIZE ANALYSIS; SILVER; TRANSMISSION ELECTRON MICROSCOPY;

CONDUCTIVE ADHESIVES; MICRO-SIZED PARTICLES;

ELECTRONICS PACKAGING;

EID: 0033316027     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.816098     Document Type: Article

References (10)

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