Evaluation of adhesive based flip-chip interconnect techniques

International Journal of Microelectronic Packaging Materials and Technologies

Volumn 1, Issue 3, 1998, Pages 187-196

  Nagle, R ^a   Stam, F ^a   Barrett, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ATMOSPHERIC HUMIDITY; BOND STRENGTH (MATERIALS); BONDING; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; GOLD; NICKEL; THERMOPLASTICS;

ANISOTROPICALLY CONDUCTIVE ADHESIVES (ACA); ISOTROPICALLY CONDUCTIVE ADHESIVES (ICA); NONCONDUCTIVE ADHESIVES (NCA);

ELECTRONICS PACKAGING;

EID: 0032299083     PISSN: 10236228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)