Electrically conductive adhesive filled with mixture of silver nano and microparticles

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1141-1146

  Mach, Pavel ^a   Radev, Radoslav ^a   Pietrikova, Alena ^b  

^a CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

^b TECHNICAL UNIVERSITY OF KO ICE   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVE JOINTS; ATMOSPHERIC HUMIDITY; ELECTRIC CONDUCTIVITY; NANOPARTICLES; STRENGTH OF MATERIALS; TENSILE STRENGTH;

ELECTRICAL CONDUCTIVITIES; ELECTRICAL RESISTANCES; ELECTRICALLY CONDUCTIVE ADHESIVES; MICRO PARTICLES; NON LINEARITIES; RELATIVE HUMIDITIES; SILVER NANOPARTICLES; STRENGTH OF ADHESIVE JOINTS; VOLTAGE CHARACTERISTICS;

SILVER;

EID: 58149086344     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684513     Document Type: Conference Paper

References (6)

1. Su, B.: Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives. Dissertation. Georgia Institute of Technology, May 2006, pp. 64-65.
2. st Electronics Systemintegration Technology Conference, 2006, vol.1, pp. 282-286.
3. Wu, H.P., Wu, X.J., Ge, M.Y., Zhang, G.Q., Wang, Y.W., Jiang, J.: "Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes." Composites Science and Technology: Vol. 67, Issue 6 (2007), pp. 1182-1186.
4. Chang, Ch., Li, W., Ruilin, L., Guohua, J., Haojie, Y., Tao, Ch.: "Effect of silver nanowires on electrical conductance of system composed of silver particles." Journal of Materials Science. Vol. 42, No 9 (2007). pp. 3172-3176
5. Lee, H. H., Chou, K. S., Shih Z. W.: "Effect of nanosized silver particles on the resistivity of polymeric conductive adhesives." International Journal of Adhesion and Adhesives, Vol. 25, Issue 5 (2005), pp. 437-441
6. Zhigalski, G.P.: "Noise 1/f and nonlinear effects in thin metal films (in Russian)." Uspěchy fyzičeskich nauk. Vol. 6 (1997), pp. 623-647.