Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 1, 1997, Pages 15-20

  Kotthaus, Stefan ^a   Günther, Bernd H ^b   Haug, Ralf ^a   Schäfer, Helmut ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Compound; Conduction mechanism; Conductive adhesives; Epoxy resin; Inert gas condensation; Isotropically conductive adhesives (ICA); Shear stress strain behavior; Silver

Indexed keywords

CONDENSATION; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; NANOSTRUCTURED MATERIALS; NUMERICAL METHODS; PLASTIC ADHESIVES; POWDER METALS; REACTION KINETICS; SILVER; STRAIN MEASUREMENT; THERMAL CYCLING; THERMODYNAMIC PROPERTIES;

CONDUCTION MECHANISM; CONDUCTIVE BONDINGS; CONDUCTIVE FILLER; ELECTRON PHOTON SCATTERING; FLAKE FILLED RESIN; INERT GAS CONDENSATION METHOD; NANOSIZE SILVER PARTICLES; THERMOMECHANICAL PROPERTIES; ZIMAN EQUATION;

CONDUCTIVE MATERIALS;

EID: 0031094286     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.558539     Document Type: Article

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