Zero thickness diffusion barriers and metallization liners for nanoscale device applications

Chemical Engineering Communications

Volumn 198, Issue 11, 2011, Pages 1453-1481

  Kaloyeros, Alain E ^a   Eisenbraun, Eric T ^a   Dunn, Kathleen ^a   van der Straten, Oscar ^b  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b IBM   (United States)

Author keywords

Diffusion barrier; Liner; Nanoscale device Metallization; Zero thickness

Indexed keywords

BARRIER FAILURE; BARRIER LAYERS; BARRIER MATERIAL; COPPER-BASED; FEATURE SIZES; INTERCONNECT RELIABILITY; INTERCONNECT STRUCTURES; KEY ELEMENTS; LINER; LONG-TERM TREND; MICRO-SCALES; NANO SCALE; NANOSCALE DEVICE; NANOSCALE REGIME; POTENTIAL BARRIERS; ZERO THICKNESS;

METALLIZING; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; THICKNESS CONTROL;

DIFFUSION BARRIERS;

EID: 79960353610     PISSN: 00986445     EISSN: 15635201     Source Type: Journal    
DOI: 10.1080/00986445.2011.576450     Document Type: Article

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