Decreasing step coverage of self-ionized plasma sputtered copper seed layer with target lifetime

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2225-2228

  Guerrieri, S ^a   Bresolin, C ^a   Marangon, T ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

Copper; Seed; SIP; Step coverage; Target

Indexed keywords

COPPER; ELECTROPLATING; FILM GROWTH; SEED; SILICON WAFERS; SPUTTERING; TARGETS; THIN FILMS;

SELF-IONIZED PLASMA (SIP); STEP COVERAGE; TARGET EROSION;

PLASMA THEORY;

EID: 33751207750     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.10.002     Document Type: Article

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