Application of equilibrium thermodynamics to the development of diffusion barriers for copper metallization

Microelectronic Engineering

Volumn 50, Issue 1-4, 2000, Pages 357-368

  Ramberg, C E ^a   Blanquet, E ^a   Pons, M ^a   Bernard, C ^a   Madar, R ^b  

^a UNIV GRENOBLE ALPES   (France)

^b Grenoble INP Phelma   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; CONDUCTIVE MATERIALS; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY OF SOLIDS; INTERFACES (MATERIALS); METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; SYNTHESIS (CHEMICAL); THERMODYNAMICS;

DIFFUSION BARRIERS; EQUILIBRIUM THERMODYNAMICS;

COPPER;

EID: 0033640194     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00303-2     Document Type: Article

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