Scaling of metal interconnects: Challenges to functionality and reliability

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 3-12

  Engelhardt, M ^a   Schindler, G ^a   Traving, M ^a   Stich, A ^a   Gabric, Z ^a   Pamler, W ^a   Honlein W ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Airgaps; Conductor scaling; Copper metallization; Diffusion barrier scaling; Size effects

Indexed keywords

EID: 33751242312     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173526     Document Type: Conference Paper

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