Interfacial adhesion of Cu to self-assembled monolayers on SiO2

Materials Research Society Symposium - Proceedings

Volumn 695, Issue , 2002, Pages 329-334

  Cui, G ^a   Lane, M ^a   Vijayamohanan, K ^a   Ramanath, G ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BINDING ENERGY; CHEMICAL BONDS; DIFFUSION IN SOLIDS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; MONOLAYERS; SELF ASSEMBLY; SILICA; THICKNESS MEASUREMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERFACIAL ADHESION; SELF ASSEMBLD MONOLAYERS;

COPPER;

EID: 0036350197     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Adhesion and debonding in microelectronic devices