Copper diffusion characteristics in single-crystal and polycrystalline TaN

Applied Physics Letters

Volumn 81, Issue 8, 2002, Pages 1453-1455

  Wang, H ^a   Tiwari, Ashutosh ^a   Zhang, X ^a   Kvit, A ^a   Narayan, J ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC NUMBERS; COPPER DIFFUSION; CU DIFFUSION; DIFFUSION DISTANCE; DIFFUSIVITIES; IN-VACUUM; OVERLAYERS; POLYCRYSTALLINE; SCANNING TRANSMISSION ELECTRON MICROSCOPY; SI(1 0 0); SINGLE-CRYSTAL FILMS; TEMPERATURE RANGE; TIN BUFFER LAYERS;

ATOMS; DEPOSITION; DIFFUSION; GRAIN BOUNDARIES; PLASTIC FILMS; PULSED LASER DEPOSITION; SODIUM CHLORIDE; TANTALUM COMPOUNDS; THIN FILMS; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; VAPOR DEPOSITION;

COPPER;

EID: 79955998235     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1502193     Document Type: Article

References (17)

1. M. Stavrev, C. Wenzel, A. Moller, and K. Drescher, Appl. Surf. Sci. 91, 257 (1995). asu ASUSEE 0169-4332
2. P. Murarka, Mater. Sci. Eng., R. 19, 87 (1997). msr MIGIEA 0927-796X
3. G. S. Chen, S. C. Huang, S. T. Chen, T. J. Yang, P. Y. Lee, J. H. Jou, and T. C. Lin, Appl. Phys. Lett. 76, 2895 (2000). apl APPLAB 0003-6951
4. D. Gerstenberg and C. J. Calbick, J. Appl. Phys. 35, 402 (1964). jap JAPIAU 0021-8979
5. N. Terao, Jpn. J. Appl. Phys. 10, 248 (1971). jja JJAPA5 0021-4922
6. M. H. Tsai, S. C. Sun, C. E. Tsai, S. H. Chuang, and H. T. Chiu, J. Appl. Phys. 79, 6932 (1996). jap JAPIAU 0021-8979
7. Y. K. Lee, K. M. Latt, K. JaeHyung, T. Osipowicz, C. Sher-Yi, and K. Lee, Mater. Sci. Eng., B 77, 282 (2000). msb MSBTEK 0921-5107
8. K. Holloway, P. M. Fryer, C. Cabral, Jr., J. M. E. Harper, P. J. Bailey, and K. H. Kelleher, J. Appl. Phys. 71, 5433 (1992). jap JAPIAU 0021-8979
9. K. H. Min, K. C. Chun, and K. B. Kim, J. Vac. Sci. Technol. B 14, 3263 (1996). jvb JVTBD9 0734-211X
10. C.-S. Shin, D. Gall, Y.-W. Kim, P. Desjardins, I. Petrov, and J. E. Greene, J. Appl. Phys. 90, 2879 (2001). jap JAPIAU 0021-8979
11. K. Y. Lim, Y. S. Lee, Y. D. Chung, I. W. Lyo, C. N. Whang, J. Y. Won, and H. J. Kang, Appl. Phys. A: Mater. Sci. Process. 70, 431 (2000). mfc APAMFC 0947-8396
12. H. Wang, A. Tiwari, A. Kvit, X. Zhang, and J. Narayan, Appl. Phys. Lett. 80, 2323 (2002). apl APPLAB 0003-6951
13. J. Narayan, P. Tiwari, X. Chen, J. Singh, R. Chowdhury, and T. Zheleva, Appl. Phys. Lett. 61, 1290 (1992); apl APPLAB 0003-6951
14. J. Narayan, U.S. Patent No. 5, 406, 123 (April 11, 1995).
15. J. Narayan and J. Washburn, Philos. Mag. 26, 1179 (1972). phm PHMAA4 0031-8086
16. M. E. Glicksman, Diffusion in Solid (Wiley Interscience, New York, 2000), p. 207.
17. T. Oku, E. Kawakami, M. Uekubo, K. Takahiro, S. Yamaguchi, and M. Murakami, Appl. Surf. Sci. 99, 265 (1996). asu ASUSEE 0169-4332