Preferentially oriented and amorphous Ti, TiN and Ti/TiN diffusion barrier for Cu prepared by ion beam assisted deposition (IBAD)

Surface and Coatings Technology

Volumn 151-152, Issue , 2002, Pages 434-439

  Chen, Kewei ^a   Yu, Yuhui ^a   Mu, Haichuan ^a   Luo, E Z ^b   Sundaravel, B ^b   Wong, S P ^b   Wilson, I H ^b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Diffusion barriers for Cu, Ti, TiN, Ti TiN multilayer; IBAD film

Indexed keywords

COPPER; DIFFUSION; GRAIN BOUNDARIES; IMPURITIES; MICROSTRUCTURE; THERMODYNAMIC STABILITY; TITANIUM COMPOUNDS;

INTERDIFFUSION;

ION BEAM ASSISTED DEPOSITION;

BARRIER; COPPER; DEPOSITION; DIFFUSION; TITANIUM; TITANIUM NITRIDE;

EID: 0036494862     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01588-2     Document Type: Article

References (7)