Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction

Microelectronic Engineering

Volumn 65, Issue 1-2, 2002, Pages 171-183

  Stegmann, Heiko ^a   Engelmann, Hans Jürgen ^a   Zschech, Ehrenfried ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

3D reconstruction; Barrier seed layer; Cu interconnect; Electron tomography; Tilt series

Indexed keywords

COPPER; IMAGE ANALYSIS; IMAGE RECONSTRUCTION; TOMOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRON TOMOGRAPHY;

MICROELECTRONICS;

EID: 0036892623     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00849-3     Document Type: Article

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