Deposition of barrier layer and CVD copper under no exposed wafer conditions : Adhesion performance and process integration

Vide: Science, Technique et Applications

Volumn 53, Issue 283 SUPPL., 1997, Pages 27-29

  Braeckelmann, G ^a   Manger, D ^a   Seo, S C ^a   Beasor, S ^a   Nijsten, S ^a   Kaloyeros, A E ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 20544436463     PISSN: 12660167     EISSN: None     Source Type: Journal    
DOI: 10.1109/mam.1997.621047     Document Type: Article

References (3)

1. See, for instance : a) M.H. Kiang, J. Tao, W. Naamgoong, C. Hu, M. Liebermann, N.W. Cheung, H.K. Kang, S.S. Wong, Mater. Res. Soc. Symp. 265, 187 (1992) ;
2. (b) S.P. Murarka, R.J. Gutman, A.E. Kaloyeros, W.A. Landford, Thin Solid Films 236, 257 (1993).
3. G. Braeckelmann, D. Manger, A. Burke, G. Peterson, A.E. Kaloyeros, C. Reidsema, T. Omstead, J. Loan, J. Sullivan ; J. Vac. Sci. Technol. B 14(3), 1828 (1996)..