Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization

Journal of Materials Science

Volumn 38, Issue 2, 2003, Pages 217-222

  Ko, Y K ^a   Jang, J H ^a   Lee, S ^a   Yang, H J ^a   Lee, W H ^a,c   Reucroft, P J ^b   Lee, J G ^a  

^a Kookmin University   (South Korea)

^b UNIVERSITY OF KENTUCKY   (United States)

^c Sejong University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DIFFUSION; ELECTRIC CONDUCTIVITY; MOLYBDENUM; MORPHOLOGY; SILICA; SILVER; SPUTTERING; TEXTURES; THERMODYNAMIC STABILITY; TITANIUM;

DIFFUSION BARRIER; DOPANTS; TEXTURE GROWTH;

METALLIZING;

EID: 0037440336     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1021184726278     Document Type: Article

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