Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 176-181

  Yang, L Y ^a   Zhang, D H ^a   Li, C Y ^b   Foo, P D ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Cu diffusion; Ta(N) barrier; Thermal stability; Ultra low k polymer

Indexed keywords

CU DIFFUSION; TA(N) BARRIERS; ULTRA-LOW-Κ POLYMERS;

COPPER; DIFFUSION; ELECTRIC RESISTANCE; GRAIN BOUNDARIES; INTERFACES (MATERIALS); PERMITTIVITY; POLYMERS; POROUS MATERIALS; THERMODYNAMIC STABILITY;

TANTALUM COMPOUNDS;

EID: 4344597871     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.070     Document Type: Article

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