Atomic layer deposition of WxN/TiN and WNxCy/TiN nanolaminates

Thin Solid Films

Volumn 434, Issue 1-2, 2003, Pages 94-99

  Elers, K E ^a   Saanila, V ^b   Li, W M ^b   Soininen, P J ^b   Kostamo, J T ^b   Haukka, S ^b   Juhanoja, J ^c   Besling, W F A ^d  

^a North Western Service Office   (United States)

^b ASM Microchemistry Oy   (Finland)

^c Top Analytica Ltd   (Finland)

^d NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Atomic layer deposition; Diffusion barrier; Titanium nitride; Tungsten nitride

Indexed keywords

COPPER; DIFFUSION; ELECTRIC CONDUCTIVITY; SURFACE CHEMISTRY; THIN FILMS; TITANIUM COMPOUNDS; TUNGSTEN COMPOUNDS; VAPOR DEPOSITION;

NANOLAMINATES;

NANOSTRUCTURED MATERIALS;

EID: 0037939729     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00501-7     Document Type: Article

References (14)

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