Erratum: Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study(ASME J. Electron. Packag.(2016) 138:2(020804) 10.1115/1.4033069);Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Journal of Electronic Packaging

Volumn 138, Issue 2, 2016, Pages

  Siow, K S ^a   Lin, Y T ^b  

^a INSTITUTE OF MICROENGINEERING AND NANOELECTRONICS IMEN   (Malaysia)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ENERGY GAP; MICROELECTRONICS; PATENTS AND INVENTIONS; SINTERING;

A: SEMICONDUCTORS; BONDING MATERIALS; BONDING METHODS; DEVICE TECHNOLOGIES; MICROELECTRONIC PACKAGING; OPERATING CONDITION; PACKAGING PROCESS; POROUS SILVER; POWER DEVICES; WIDE-BAND-GAP;

SUBSTRATES;

EID: 84973660949     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4033633     Document Type: Erratum

References (120)

1. Layani, M., and Magdassi, S., 2011, "Flexible Transparent Conductive Coatings by Combining Self-Assembly With Sintering of Silver Nanoparticles Performed at Room Temperature," J. Mater. Chem., 21(39), pp. 15378-15382.
2. Peng, P., Hu, A., Gerlich, A. P., Zou, G., Liu, L., and Zhou, Y. N., 2015, "Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications," ACS Appl. Mater. Interface, 7(23), pp. 12597-12618.
3. Siow, K. S., 2012, "Mechanical Properties of Nano-Ag as Die Attach Materials," J. Alloys Compd., 514(c), pp. 6-14.
4. Siow, K. S., 2014, "Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?," J. Electron. Mater., 43(4), pp. 947-961.
5. Khazaka, R., Mendizabal, L., and Henry, D., 2014, "Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability," J. Electron. Mater., 43(7), pp. 2459-2466.
6. Siemens, 1987, "Method of Securing Electronic Components to a Substrate," U.S. Patent No. US4810672B2.
7. Zuruzi, A. S., Lahiri, S. K., Burman, P., and Siow, K. S., 2001, "Correlation Between Intermetallic Thickness and Roughness During Solder Reflow," J. Electron. Mater., 30(8), pp. 997-1000.
8. Pang, H. L. J., Tan, K. H., Shi, X. Q., and Wang, Z. P., 2001, "Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging," Mater. Sci. Eng. A, 307(1-2), pp. 42-50.
9. Che, F. X., and Pang, J. H. L., 2012, "Characterization of IMC Layer and Its Effect on Thermomechanical Fatigue Life of Sn-3.8Ag-0.7Cu Solder Joints," J. Alloys Compd., 541, pp. 6-13.
10. Buttay, C., Planson, D., Allard, B., Bergogne, D., Bevilacqua, P., Joubert, C., Lazar, M., Martin, C., Morel, H., Tournier, D., and Raynaud, C., 2011, "State of the Art of High Temperature Power Electronics," Mater. Sci. Eng. B: Solid- State Mater. Adv. Technol., 176(4), pp. 283-288.
11. Wang, T., Zhao, M., Chen, X., Lu, G. Q., Ngo, K., and Luo, S., 2012, "Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste," J. Electron. Mater., 41(9), pp. 2543-2552.
12. Schmitt, W., 2010, "Novel Silver Contact Paste Lead Free Solution for Die Attach," 6th International Conference on Integrated Power Electronics Systems (CIPS), Nuremberg, Germany, Mar. 16-18.
13. Fu, S., Mei, Y., Li, X., Ning, P., and Lu, G. Q., 2015, "Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging," J. Electron. Mater., 44(10), pp. 3973-3984.
14. Egelkraut, S., Frey, L., Knoerr, M., and Schletz, A., 2010, "Evolution of Shear Strength and Microstructure of Die Bonding Technologies for High Temperature Applications During Thermal Aging," 12th Electronic Packaging Technology Conference (EPTC), Singapore, Dec. 8-10, pp. 660-667.
15. Khazaka, R., Thollin, B., Mendizabal, L., Henry, D., Khazaka, R., and Hanna, R., 2015, "Characterization of Nanosilver Dry Films for High-Temperature Applications," IEEE Trans. Device Mater. Reliab., 15(2), pp. 149-155.
16. Paknejad, S., Dumas, G., West, G., Lewis, G., and Mannan, S., 2014, "Microstructure Evolution During 300 °C Storage of Sintered Ag Nanoparticles on Ag and Au Substrates," J. Alloy Compd., 617, pp. 994-1001.
17. Fang, Y., Johnson, R. W., and Hamilton, M. C., 2015, "Pressureless Sintering of Microscale Silver Paste for 300 C Applications," IEEE Trans. Compon. Packag. Manuf. Technol., 5(9), pp. 1258-1264.
18. Chen, S., Fan, G., Yan, X., LaBarbera, C., Kresge, L., and Lee, N. C., 2015, "Achieving High Reliability Via Pressureless Sintering of Nano-Ag Paste for Die-Attach," 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, China, Aug. 11-14, pp. 367-374.
19. Morita, T., Ide, E., Yasuda, Y., Hirose, A., and Kobayashi, K., 2008, "Study of Bonding Technology Using Silver Nanoparticles," Jpn. J. Appl. Phys. Part 1, 47(8 PART 1), pp. 6615-6622.
20. Chua, S., Siow, K., and Jalar, A., 2016, "Microstructural Studies and Bonding Strength of Presssureless Sintered Nano-Silver Joints on Silver, Direct Bond Copper (DBC) and Copper Substrates at 300 °C," J. Alloy Compd. (submitted).
21. Wang, L., 2015, "Low Temperature Hermertic Packaging With Ag Sintering Process," 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, China, Aug. 11-14, pp. 1317-1320.
22. Zheng, H., Berry, D., Ngo, K. D., and Lu, G. Q., 2014, "Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere.," IEEE Trans. Compon. Packag. Manuf. Technol., 4(3), pp. 377-384.
23. Hausner, S., Weiss, S., Wielage, B., and Wagner, G., 2015, "Joining of Copper at Low Temperatures Using Ag Nanoparticles: Influence of Process Parameters on Mechanical Strength," International Brazing & Soldering Conference (IBSC 2015), Long Beach, CA, Apr. 19-22.
24. Fu, S., Mei, Y., Li, X., Ning, P., and Lu, G. Q., 2015, "Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging," J. Electron. Mater., 44(10), pp. 3973-3984.
25. Schmitt, W., 2010, "New Silver Contact Pastes From High Pressure Sintering to Low Pressure Sintering," 3rd Electronic System-Integrated Technology Conference (ESTC), Berlin, Germany, Sept. 13-16.
26. Knoerr, M., and Schletz, A., 2010, "Power Semiconductor Joining Through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability," 6th International Conference on Integrated Power Electronic Systems (CIPS), Nuremburg, Germany, Mar. 16-18.
27. Wei, Z., Zhou, M., Qiao, H., Zhu, L., Yang, H., and Xia, T., 2009, "Particle Size and Pore Structure Characterization of Silver Nanoparticles Prepared by Confined Arc Plasma," J. Nanomater., 2009, p. 968058.
28. Skandan, G., 1995, "Processing of Nanostructured Zirconia Ceramics," Nanostruct. Mater., 5(2), pp. 111-126.
29. Mackenzie, J. K., and Shuttleworth, R., 1949, "A Phenomenological Theory of Sintering," Proc. Phys. Soc. Sect. B, 62(12), pp. 833-852.
30. Hitachi Ltd., 2008, "Method for Mounting an Electronic Part on a Substrate Using a Liquid Containing Metal Particles," U.S. Patent No. US7393771B2.
31. Tanaka Kikinzoku, 2005, "Metal Paste and Film Formation Method Using the Same," U.S. Patent No. US20050127332A1.
32. Tanaka Kikinzoku, 2010, "Method of Bonding," U.S. Patent No. US7789287B2.
33. Applied Nanoparticle Laboratory Chip, Nihon Superior, 2015, "Oxygen Source-Containing Composite Nanometal Paste and Joining Method," U.S. Patent No. US20150037197A1.
34. Heraeus, 2015, "Metal Paste With Oxidizing Agents," U.S. Patent No. US8950652B2.
35. Herboth, T., Fruh, C., Gunther, M., and Wilde, J., 2012, "Assessment of Thermo-Mechanical Stresses in Low Temperature Joining Technology," 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Cascais, Portugal, Apr. 16-18, pp. 1/7-7/7.
36. Siemens, 1987, "Method for Fastening Electronic Components to a Substrate Using a Film," U.S. Patent No. US4856185A.
37. Virginia Tech Intell Prop, 2012, "Nanoscale Metal Paste for Interconnect and Method of Use," U.S. Patent No. US8257795B2.
38. Heraeus Deutschland, 2015, "Contacting Means and Method for Contacting Electrical Components," U.S. Patent No. US8925789B2.
39. Henkel, 2015, "Metal Sintering Film Compositions," U.S. Patent No. WO/ 2015/034579.
40. Alpha Metals and Setna Rohan, 2014, "Sintering Powder," U.S. Patent No. WO/2014/068299.
41. Int Rectifier, 2012, "Porous Metallic Fim as Die Attach and Interconnect," U.S. Patent No. US20130256894A1.
42. Kim, M. S., and Nishikawa, H., 2014, "Silver Nanoporous Sheet for Solid-State Die Attach in Power Device Packaging," Scr. Mater., 92, pp. 43-46.
43. Alpha Metals, 2015, "Composite and Multilayered Silver Films for Joining Electrical and Mechanical Components," U.S. Patent No. WO/2015/031801.
44. Hitachi Chem., 2015, "Silver Paste Composition and Semiconductor Device Using Same," U.S. Patent No. US20150217411A1.
45. Hitachi, 2014, "Bonding Method and Bonding Material Using Metal Particle," U.S. Patent No. US8821768B1.
46. Virginia Tech Intell Prop, 2005, "Nano-Metal Composite Made by Deposition From Colloidal Suspensions," U.S. Patent No. US20050127134A1.
47. Meschi Amoli, B., Hu, A., Zhou, N. Y., and Zhao, B., 2015, "Recent Progresses on Hybrid Micro-Nano Filler Systems for Electrically Conductive Adhesives (ECAs) Applications," J. Mater. Sci. Mater. Electron., 26(7), pp. 4730-4745.
48. Applied Nanoparticle Laboratory and Toyota Motor, 2013, "Three-Metallic- Component Type Composite Nanometallic Paste, Method of Bonding, and Electronic Component," U.S. Patent No. US8497022B2.
49. Morisada, Y., Nagaoka, T., Fukusumi, M., Kashiwagi, Y., Yamamoto, M., Nakamoto, M., Kakiuchi, H., and Yoshida, Y., 2011, "A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles," J. Electron. Mater., 40(12), pp. 2398-2402.
50. Kiełbasiński, K., Szałapak, J., Jakubowska, M., Młozniak, A., Zwierkowska, E., Krzemiński, J., and Teodorczyk, M., 2015, "Influence of Nanoparticles Content in Silver Paste on Mechanical and Electrical Properties of LTJT Joints," Adv. Powder Technol., 26(3), pp. 907-913.
51. Samsung Electro Mech., 2014, "Power Module Using Sintering Die Attach and Manufacturing Method Thereof," U.S. Patent No. US8630097B2.
52. Samsung Electro Mech., 2012, "Conductive Metal Paste Composition and Method of Manufacturing the Same," U.S. Patent No. US20120219787A1.
53. Baker Hughes Inc., 2011, "Method and Apparatus for Joining Members for Downhole and High Temperature Applications," U.S. Patent No. US20120292009A1.
54. Brouwers, H., 2006, "Particle-Size Distribution and Packing Fraction of Geometric Random Packings," Phys. Rev. E, 74(3), p. 031309.
55. Suganuma, K., Sakamoto, S., Kagami, N., Wakuda, D., Kim, K. S., and Nogi, M., 2011, "Low-Temperature Low-Pressure Die Attach With Hybrid Silver Particle Paste," Microelectron. Reliab., 52(2), pp. 375-380.
56. Göbl, C., and Beckedahl, P., 2008, "A New 3D Power Module Packaging Technology Without Bondwires," International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2008), Nuremberg, Germany, May 27-29, pp. 561-566.
57. Heraeus, 2009, "Process and Paste for Contacting Metal Surfaces," U.S. Patent No. US20090134206A1.
58. Nichia, 2015, "Method for Producing Conductive Material, Conductive Material Obtained by the Method, Electronic Device Containing the Conductive Material, Light-Emitting Device, and Method for Producing Light-Emitting Device," U.S. Patent No. US8968608B2.
59. Henkel, 2015, "Sinterable Silver Flake Adhesive for Use in Electronics," U.S. Patent No. US8974705B2.
60. Henkel, 2015, "Sinterable Metal Particles and the Use Thereof in Electronics Applications," U.S. Patent No. WO/2015/126807.
61. Kaken Tech, 2015, "Conductive Paste and Die Bonding Method," U.S. Patent No. US20150115018A1.
62. Scola, J., Tassart, X., Vilar, C., Jomard, F., Dumas, E., Veniaminova, Y., Boullay, P., and Gascoin, S., 2015, "Microstructure and Electrical Resistance Evolution During Sintering of a Ag Nanoparticle Paste," J. Phys. D: Appl. Phys., 48(14), p. 145302.
63. Heraeus 2015, "Metal Paste With Co-Precursors," U.S. Patent No. US8950653B2.
64. Hitachi Chem., 2011, "Adhesive Composition and Semiconductor Device Using the Same," U.S. Patent No. US20130183535A1.
65. Henkel, 2014, "Silver Sintering Compositions With Fluxing or Reducing Agents for Metal Adhesion," U.S. Patent No. US20140030509A1.
66. Infineon Tech., 2008, "Module Including a Sintered Joint Bonding a Semiconductor Chip," U.S. Patent No. US8253233B2.
67. Robert Bosch, 2013, "Starting Material and Process for Producing a Sintered Joint," U.S. Patent No. US20130216848A1.
68. Zhang, H., Nagao, S., and Suganuma, K., 2015, "Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag," J. Electron. Mater., 44(10), pp. 3896-3903.
69. Heuck, N., Langer, A., Stranz, A., Palm, G., Sittig, R., Bakin, A., and Waag, A., 2011, "Analysis and Modeling of Thermomechanically Improved Silver- Sintered Die-Attach Layers Modified by Additives," IEEE Trans. Compon. Packag. Manuf. Technol., 1(11), pp. 1846-1855.
70. Zabihzadeh, S., Van Petegem, S., Duarte, L. I., Mokso, R., Cervellino, A., and Van Swygenhoven, H., 2015, "Deformation Behavior of Sintered Nanocrystalline Silver Layers," Acta Mater., 97, pp. 116-123.
71. Alayli, N., Schoenstein, F., Girard, A., Tan, K. L., and Dahoo, P. R., 2014, "Spark Plasma Sintering Constrained Process Parameters of Sintered Silver Paste for Connection in Power Electronic Modules: Microstructure, Mechanical and Thermal Properties," Mater. Chem. Phys., 148(1-2), pp. 125-133.
72. Indium Corp., 2015, "Indium Corp. IndalloyVR 151 Pb-Sn-Ag Solder Alloy," MatWeb LLC, Blacksburg, VA.
73. Youssef, T., Rmili, W., Woirgard, E., Azzopardi, S., Vivet, N., Martineau, D., Meuret, R., Le Quilliec, G., and Richard, C., 2015, "Power Modules Die Attach: A Comprehensive Evolution of the Nanosilver Sintering Physical Properties Versus Its Porosity," Microelectron. Reliab., 55(9-10), pp. 1997-2002.
74. Wereszczak, A. A., Vuono, D. J., Wang, H., Ferber, M. K., and Liang, Z., 2012, "Properties of Bulk Sintered Silver as a Function of Porosity," Oak Ridge National Laboratory, Oak Ridge, TN, Report No. ORNL/TM-2012/130.
75. Namics, 2015, "Conductive Paste and Method for Producing a Semiconductor Device Using the Same," U.S. Patent No. WO/2015/108205.
76. Infineon Tech, 2014, "Semiconductor Device Including Diffusion Soldered Layer on Sintered Silver Layer," U.S. Patent No. US8736052B2.
77. Toyoda Gosei Co., 2014, "Method for Mounting Luminescent Device," U.S. Patent No. US8852970B2.
78. Ixys, 2014, "Solderless Die Attach to a Direct Bonded Aluminum Substrate," U.S. Patent No. US8716864B2.
79. Ixys, 2014, "Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wire Attach," U.S. Patent No. US8653667B2.
80. Infineon Tech, 1999, "Pressure Sintering Method for Fastening Electronic Components on a Substrate," U.S. Patent No. US5893511B2.
81. Kuramoto, M., Kunimune, T., Ogawa, S., Niwa, M., Kim, K. S., and Suganuma, K., 2012, "Low Temperature and Pressureless Ag-Ag Direct Bonding for Light Emitting Diode Die-Attachment," IEEE Trans. Compon. Packag. Manuf. Technol., 2(4), pp. 548-552.
82. Nichia, 2015, "Semiconductor Device and Production Method Therefor," U.S. Patent No. US8927341B2.
83. Nichia, 2014, "Light Emitting Semiconductor Element Bonded to a Base by a Silver Coating," U.S. Patent No. US8836130B2.
84. Heuck, N., Palm, G., Sauerberg, T., Stranz, A., Waag, A., and Bakin, A., 2010, "SiC Die-Attachment for High Temperature Applications," Mater. Sci. Forum, 645-648, pp. 741-744.
85. Texas Instruments Inc., 2015, "Embedded Silver Nanomaterials Into Die Backside to Enhance Package Performance and Reliability," U.S. Patent No. US20150069600A1.
86. Infineon Tech, 2010, "Apparatus and Method for Producing Semiconductor Modules," U.S. Patent No. US7851334B2.
87. Semikron Electronics, 2009, "Power Semiconductor Substrates With Metal Contact Layer and Method of Manufacture Thereof," U.S. Patent No. US20090008784A1.
88. Heraeus, 2010, "Controlling the Porosity of Metal Pastes for Pressure Free, Low Temperature Sintering Process," U.S. Patent No. US2010/0051319A1.
89. Zhao, S. Y., Li, X., Mei, Y. H., and Lu, G. Q., 2015, "Study on High Temperature Bonding Reliability of Sintered Nano-Silver Joint on Bare Copper Plate," Microelectron. Reliab., 55(12), pp. 2524-2531.
90. Siemens AG, 2004, "Heat Conducting Adhesive Joint With an Adhesive- Filled Porous Heat Conductor," U.S. Patent No. US6823915B2.
91. Danfoss Power Solutins, 2012, "Method for Producing a High-Temperature and Temperature-Change Resistant Connection Between a Semiconductor Module and a Connection Partner," U.S. Patent No. US20120037688A1.
92. Infineon Tech, 2014, "Pre-Sintered Semiconductor Die Structure," U.S. Patent No. US8835299B2.
93. Gobl, C., and Faltenbacher, J., 2010, "Low Temperature Sinter Technology Die Attachment for Power Electronic Applications," 6th International Conference on Integrated Power Electron Systems (CIPS), Nuremberg, Germany, Mar. 16-18.
94. Kraft, S., Zischler, S., Tham, N., and Schletz, A., 2013, "Properties of a Novel Silver Sintering Die Attach Material for High Temperature-High Lifetime Applications," SENSOR 2013, Nurenberg, Germany, May 14-16, pp. 242-247.
95. DeVoto, D., Mihalic, M., and Paret, P., "Reliability of Bonded Interfaces," National Renewable Energy Laboratory, Golden, CO, NREL Report No. APE028.
96. Siow, K. S., Tay, A. A. O., and Oruganti, P., 2004, "Mechanical Properties of Nanocrystalline Copper and Nickel," Mater. Sci. Technol., 20(3), pp. 285-294.
97. Chawla, N., and Deng, X., 2005, "Microstructure and Mechanical Behavior of Porous Sintered Steels," Mater. Sci. Eng. A, 390(1), pp. 98-112.
98. Alent Alpha, and Fico Besi, 2013, "Argomax Ultra Fast Sintering," Alpha, South Plainfield, NJ, accessed Mar. 2, 2016, http://www.alphadieattach.com/ UFS-Ultra-Fast-Sintering.asp
99. Infineon Tech, 2014, "Semiconductor Device and Method," U.S. Patent No. US8828804B2.
100. Infineon Tech, 2014, "Device Including a Semiconductor Chip and a Carrier and Fabrication Method," U.S. Patent No. US8637379B2.
101. Alpha Metals, 2012, "Sintering Materials and Attachments Methods Using Same," U.S. Patent No. US20120114927A1.
102. Semikron Electrinic, 2012, "Power Semiconductor Component With Metal Contact Layer and Production Method Therefor," U.S. Patent No. US8110925B2.
103. Ixys, 2012, "Solderless Die Attach to a Direct Bonded Aluminum Substrate," U.S. Patent No. US8716864B2.
104. Alpha Metals, 2011, "Sintering Materials and Attachment Methods Using Same," U.S. Patent No. US20120114927A1.
105. Valtion Teknillinen, 2015, "Method for Manufacturing Conductors and Semiconductors," U.S. Patent No. US9011762B2.
106. Mei, Y., Cao, Y., Chen, G., Li, X., Lu, G. Q., and Chen, X., 2013, "Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging," IEEE Trans. Device Mater. Reliab., 13(1), pp. 258-265.
107. Robert Bosch, 2015, "Two-Step Method for Joining a Semiconductor to a Substrate With Connecting Material Based on Silver," U.S. Patent No. US20150123263A1.
108. Toyota, 2010, "Bonding Method," U.S. Patent No. US7770781B2.
109. Valeo Electronique, 2008, "Method of Assembling a Member on a Support by Sintering a Mass of Conductive Powder," U.S. Patent No. US8444913B2.
110. Boschman, 2014, "Advanced Molding and Sintering Systems: Sinterstar Innovate F-XL," Boschman Technologies B.V., Duiven, The Netherlands.
111. Locatelli Meccanica, 2016, "Hydraulic Presses," Locatelli Meccanica S.r.l., Subbiano, Italy.
112. ABB Research, 2005, "Method for Mounting Electronic Components on Substrates," U.S. Patent No. US6935556B2.
113. Freescale Semiconductor Inc., 2015, "Packaged Semiconductor Devices and Methods of Their Fabrication," U.S. Patent No. US9099567B1.
114. Int Rectifier, 2014, "Sintering Utilizing Non-Mechanical Pressure," U.S. Patent No. US20140224409A1.
115. Infineon Tech, 2012, "Method for Producing a Composite and a Power Semiconductor Module," U.S. Patent No. US20130203218A1.
116. Li, Y., Jing, H., Han, Y., Xu, L., and Lu, G., 2016, "Microstructure and Joint Properties of Nano-Silver Paste by Ultrasonic-Assisted Pressureless Sintering," J. Electron. Mater., (epub ahead of print).
117. Krebs, T. H., 2012, "mAgic-Novel Sintering Materials for Die Attach on DCB," PowerGuru (epub ahead of print).
118. Riva, R., Buttay, C., Allard, B., and Bevilacqua, P., 2013, "Migration Issues in Sintered-Silver Die Attaches Operating at High Temperature," Microelectron. Reliab., 53(9), pp. 1592-1596.
119. Mei, Y., Lu, G. Q., Chen, X., Luo, S., and Ibitayo, D., 2011, "Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 and 400 in Dry Air," IEEE Trans. Device Mater. Reliab., 11(2), pp. 316-322.
120. Utterback, J. M., 1996, Mastering the Dynamics of Innovation, 2nd ed., Harvard Press, Boston.