Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8Ag-0.7Cu solder joints

Journal of Alloys and Compounds

Volumn 541, Issue , 2012, Pages 6-13

  Che, F X ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Fatigue life; Finite element modeling; Intermetallic compound; Lead free solder; Nanoindentation test; Sn Ag Cu

Indexed keywords

AGING TIME; FEA SIMULATION; FINITE ELEMENT MODELING; IMC LAYER; INTERMETALLIC COMPOUND GROWTHS; ISOTHERMAL AGING; LEAD FREE SOLDERS; MEAN TIME TO FAILURE; NANOINDENTATION TESTS; PB FREE SOLDERS; PLASTIC BALL GRID ARRAYS; SN-3.8AG-0.7CU SOLDER; SN-AG-CU; SOLDER JOINTS; THERMAL CYCLING TEST; THERMO MECHANICAL FATIGUES (TMF); YOUNG'S MODULUS;

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; NANOINDENTATION; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING ALLOYS; THICKNESS MEASUREMENT;

TIN;

EID: 84864797235     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2012.06.104     Document Type: Article

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