Assessment of thermo-mechanical stresses in low temperature joining technology

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012

Volumn , Issue , 2012, Pages

  Herboth, Thomas ^a   Früh, Christiane ^a   Günther, Michael ^a   Wilde, Jürgen ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLYING PRESSURE; COPPER SUBSTRATES; JOINING TECHNOLOGY; LOW TEMPERATURES; SILICON MOSFET; SINTERED JOINT; SINTERED MATERIALS; SINTERING PRESSURE; SINTERING PROCESS; THERMO-MECHANICAL STRESS;

EXPERIMENTS; JOINING; MICROELECTRONICS; MICROSYSTEMS; RESIDUAL STRESSES; TEMPERATURE;

SINTERING;

EID: 84861355913     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESimE.2012.6191762     Document Type: Conference Paper

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