Achieving high reliability via pressureless sintering of nano-Ag paste for die-attach

16th International Conference on Electronic Packaging Technology, ICEPT 2015

Volumn , Issue , 2015, Pages 367-374

  Chen, Sihai ^a   Fan, Guangyu ^a   Yan, Xue ^a   Labarbera, Chris ^a   Kresge, Lee ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

Ag paste; die attach; sintering

Indexed keywords

DIES; ELECTRONICS PACKAGING; GOLD; INTERMETALLICS; LEAD; POROSITY; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; THERMAL AGING;

AG PASTES; BONDLINE THICKNESS; DIE-ATTACH; DIRECT BONDED COPPERS; MAXIMUM SERVICE TEMPERATURE; PRESSURE-LESS SINTERING; PRESSURELESS SINTERING PROCESS; SINTERING SHRINKAGE;

SINTERING;

EID: 84957794645     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2015.7236609     Document Type: Conference Paper

References (3)

1. Kim S. Siow (Onsemi), "Mechanical properties of nano-silver joints as die attach materials", Journal of Alloys and Compounds 514 ( 2012) 6-19
2. Jianfeng Yan, Guisheng Zou, Ai-ping Wu, Jialie Ren, Jiuchun Yan, Anming Huc and Y. Zhoua, "Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging", Available online at www. sciencedirect. com; Scripta Materialia 66 ( 2012) 582-585
3. Soichi Sakamoto and Katuaki Suganuma (Osaka Univ), "Thermo mechanical Reliability of Low-temperature Low-pressure Die B onding Using Thin Ag Flake Pastes", crps 2012, March 6-8, 2012, Nuremberg, Germany