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Volumn , Issue , 2010, Pages
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New silver contact pastes from high pressure sintering to low pressure sintering
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING PROCESS;
DIE-ATTACH APPLICATIONS;
ELECTRICAL AND THERMAL CONDUCTIVITIES;
HIGH PRESSURE;
HIGH PRESSURE SINTERING;
JOINING TECHNOLOGY;
LEAD-FREE;
LOW PRESSURES;
LOW TEMPERATURES;
MICRO-SCALES;
NOVEL CONCEPT;
PROCESS ROUTE;
SILVER CONTACTS;
SILVER PARTICLES;
SILVER PASTES;
ELECTRIC PROPERTIES;
JOINING;
SHEAR STRENGTH;
SILVER;
SINTERING;
ORGANIC POLYMERS;
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EID: 78651378452
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESTC.2010.5642933 Document Type: Conference Paper |
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Times cited : (10)
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References (7)
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