Analysis and modeling of thermomechanically improved silver-sintered die-attach layers modified by additives

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 11, 2011, Pages 1846-1855

  Heuck, Nicolas ^a   Langer, Armin ^a   Stranz, Andrej ^a   Palm, Gerhard ^a   Sittig, Roland ^a   Bakin, Andrey ^a   Waag, Andreas ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Coefficient of thermal expansion; low temperature joining technique; modeling; porous materials

Indexed keywords

ANALYSIS AND MODELING; ELECTRICAL CONDUCTIVITY; FILLING MATERIALS; FINITE-ELEMENTS METHOD; JOINING TECHNIQUES; LOW TEMPERATURES; STRESS REDUCTION; SUBMICROMETERS; TEMPERATURE CYCLING; THERMO-MECHANICAL STRESS;

ADDITIVES; BORON NITRIDE; DIES; ELASTICITY; ELECTRIC CONDUCTIVITY; ELECTRONICS INDUSTRY; INDUSTRIAL APPLICATIONS; JOINING; MODELS; POROUS MATERIALS; POWER ELECTRONICS; SILICON CARBIDE; SINTERING; TEMPERATURE; THERMAL EXPANSION;

SILVER;

EID: 84859035349     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2167154     Document Type: Article

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