State of the art of high temperature power electronics

Materials Science and Engineering: B

Volumn 176, Issue 4, 2011, Pages 283-288

  Buttay, Cyril ^a,b,c,d   Planson, Dominique ^a,b,c,d   Allard, Bruno ^a,b,c,d   Bergogne, Dominique ^a,b,c,d   Bevilacqua, Pascal ^a,b,c,d   Joubert, Charles ^a,b,c,d   Lazar, Mihai ^a,b,c,d   Martin, Christian ^a,b,c,d   Morel, Hervé ^a,b,c,d   Tournier, Dominique ^a,b,c,d   Raynaud, Christophe ^a,b,c,d  

^a UNIVERSITÉ DE LYON   (France)

^b UNIVERSITÉ DE LYON   (France)

^c UNIVERSITÉ LYON 1   (France)

^d CNRS   (France)

Author keywords

High temperature electronics; Power electronics; Semiconductor devices; Silicon carbide

Indexed keywords

PETROLEUM TRANSPORTATION; SEMICONDUCTOR DEVICES; WIDE BAND GAP SEMICONDUCTORS;

C APPLICATION; DESIGN AND BUILD; HIGH TEMPERATURE POWER ELECTRONICS; HIGH-TEMPERATURE ELECTRONICS; OIL AND GAS WELL DRILLING; POWER; POWER-ELECTRONICS; SILICON CARBIDE DEVICES; STATE OF THE ART; WIDE-BAND-GAP SEMICONDUCTOR;

SILICON CARBIDE;

EID: 79951852730     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2010.10.003     Document Type: Review

References (44)

1. MOET Consortium, Project Year 1 Executive Summary, Report, MOET FP6, September 2007, http://www.eurtd.com/moet/PDF/MOETutive.
2. I.S. Mehdi, A.E. Brockschmidt, and K.J. Karimi Proceedings of the High Temperature Electronics Conference (HiTEC), IMAPS Santa Fe, NM 2006
3. J.G. Kassakian, and D.J. Perreault Proceedings of the International Symposium on Power Semiconductor Devices and ICs (ISPSD) Osaka, Japan 2001 15 19
4. L.D. Marlino Proceedings of the High Temperature Electronics Conference (HiTEC), IMAPS Santa Fe, NM 2006
5. E. Kolawa, M. Mojarradi, and T. Balint Proceedings of the High Temperature Electronics Conference (HiTEC), IMAPS 2006
6. Corac, Downhole Gas Compression, product brochure, Corac Group plc, 2005, http://corac.hostinguk.com/media/6181/downholecompressor
7. B.W. Ohme, M.R. Larson, J. Riekels, S. Schlesinger, K. Vignarajah, and E.M. Nance Proceedings of the High Temperature Electronics Conference (HiTEC), IMAPS Santa Fe 2006 9
8. C. Raynaud, D. Tournier, H. Morel, and D. Planson Diamond and Related Materials 19 1 2010 1 6 10.1016/j.diamond.2009.09.015 http://www.sciencedirect. com/science/article/B6TWV-4XCJ4M2-1/2/76c76271c9345bf77d4fc29077179d2a
9. B.J. Baliga Proceedings of the IEEE 89 6 2001 822 832
10. T. Funaki, J.C. Balda, J. Junghans, A. Jangwanitlert, S. Mounce, F.D. Barlow, H.A. Mantooth, T. Kimoto, and T. Hikihara IEICE Electronics Express 2 3 2005 97 102
11. A. Ward, SiC Power Diode Reliability, Application note, CREE, 4600, Silicon Drive, Durham, NC, October 2008, http://www.cree.com/products/power- docs6.asp
12. K. Sheng, Y. Zhang, M. Su, J.H. Zhao, X. Li, P. Alexandrov, and L. Fursin Solid State Electronics 52 2008 1636 1646 10.1016/j.sse.2008.06.037
13. R. Singh Microelectronics and Reliability 46 5-6 2006 713 730 10.1016/j.microrel.2005.10.013 http://www.sciencedirect.com/science/article/ B6V47-4HWXB3M-2/2/02f58ec8df1b660394443def81b857e3
14. B. Ray, J.D. Scofield, R.L. Spyker, B. Jordan, and S.-H. Ryu Proceedings of the 20th Applied Power Electronics Conference (APEC), IEEE Austin, TX 2005 315 321
15. J. Richmond, S.-H. Ryu, Q. Zhang, B. Hull, M. Das, A. Burk, A. Agarwal, and J. Palmour Proceedings of the IMAPS International Conference and Exhibition on on High Temperature Electronics (HiTEC 2010), IMAPS Albuquerque, NM 2010 136 143
16. K. Matocha, P.A. Losee, A. Gowda, E. Delgado, G. Dunne, R. Beaupre, and L. Stevanovic Material Science Forum 645-648 2010 1123 1126 10.4028/www. scientific.net/MSF.6448.1123 http://www.scientific.net/MSF.645-648.1123
17. J. Casady, D. Sheridan, A. Ritenour, V. Bondarenko, and R. Kelley Proceedings of the IMAPS International Conference and Exhibition on on High Temperature Electronics (HiTEC 2010), IMAPS Albuquerque, NM 2010 152 159
18. P. Borthen, and G. Wachutka 19th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2008) Microelectronics Reliability 48 8 2008 1440 1443 10.1016/j.microrel.2008.07.037 http://www.sciencedirect.com/science/article/B6V47-4T622B7-2/2/ 2b6ac6c63d79b58062aa19b682d36f6a
19. P.G. Muzykov, R.M. Kennedy, Q.J. Zhang, C. Capell, A. Burk, A. Agarwal, T.S. Sudarshan, Microelectronics Reliability, in press, doi:10.1016/j.microrel. 2008.10.009, http://www.sciencedirect.com/science/article/B6V47-4V1MFNF-1/2/ 5342a29dfc648e85b99f688e185af93a
20. C. Buttay, J. Rashid, C. Mark Johnson, P. Ireland, F. Udrea, G. Amaratunga, and R. Malhan Proceedings of European Conference on Power Electronics and Applications EPE, Aalborg, Denmark 2007 1 9 10.1109/EPE.2007. 4417363
21. J.M. Hornberger, E. Cilio, R.M. Schupbach, A.B. Lostetter, and H.A. Mantooth Proceedings of the 37th Power Electronics Specialists Conference (PESC), IEEE Jeju, Korea 2006 9 15
22. D. Bergogne, H. Morel, D. Tournier, B. Allard, D. Planson, C. Raynaud, and M. Lazar Proceedings of the 5th Conference on Integrated Power Systems (CIPS) 2008
23. D. Bergogne, H. Morel, D. Planson, D. Tournier, P. Bevilacqua, B. Allard, R. Meuret, S. Vieillard, S. Raël, and F. Meibody Tabar Proceedings of the Power Electronics Specialists Conference (PESC), IEEE 2008
24. I. Corp, Alloy Sorted by Temperature, datasheet (no date mentionned), http://www.indium.com/products/alloychart.php
25. T. Funaki, J.C. Balda, J. Junghans, A.S. Kashyap, H.A. Mantooth, F. Barlow, T. Kimoto, and H. Takashi IEEE Transactions on Power Electronics 22 4 2007 1321 1329
26. J. Zhang, P. Alexandrov, J.H. Zhao, Materials Science Forum 600-603 (2008) 1155-1158. doi:10.4028/www.scientific.net/MSF.600-603.1155. URL http://www.scientific.net/MSF.600-603.1155.
27. A. Lindgren, and M. Domeij Proceedings of the IMAPS International Conference and Exhibition on on High Temperature Electronics (HiTEC 2010), IMAPS Albuquerque, NM 2010 160 166
28. Y. Negoro, A. Horiuchi, K. Iwanaga, S. Yokoyama, H. Hashimoto, K. Nonaka, Y. Maeyama, M. Sato, M. Shimizu, Iwakuro, and Hiroaki Material Science Forum 615-617 2009 837 840 10.4028/www.scientific.net/MSF.615-617.837 http://www.scientific.net/MSF.615-617.837
29. W.W. Sheng, and R.P. Colino Power Electronic Modules: Design and Manufacture 1st edition 2004 CRC
30. H. Schwarzbauer, and R. Kuhnert IEEE Transactions on Industry Applications 27 1 1991 93 95 doi:10.1109/28.67536
31. H. Schwarzbauer, Method of securing electronic components to a substrate, March 1989, http://www.google.com/patents/about?id=ViVhAAAAEBAJ dq=4810672
32. C. Göbl, P. Beckedahl, and H. Braml Automotive Power Electronics Paris 2006 5 www.semikron.com/internet/webcms/objects/pdf/APE2006-Goebl.pdf
33. G. Bai, Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection, Ph.D. Thesis, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, October 2005, http://scholar.lib.vt.edu/theses/available/etd-10312005-163634/unrestricted/ Dissertation-GBai05.pdf
34. J.G. Bai, J. Yin, Z. Zhang, G.-Q. Lu, and Jacobus Daniel van Wyk IEEE Transactions on Advanced Packaging 30 3 2007 506 510 10.1109/TADVP.2007.898628
35. R. Kisiel, and Z. Szczepanski Microelectronics Reliability 49 6 2009 627 629 10.1016/j.microrel.2009.03.009 http://www.sciencedirect.com/science/article/ B6V47-4W50K7V-1/2/6e2338ed2ddf580b206f2dcdbb3b6089
36. J. Roman, and T. Eagar I. International Society for Hybrid Microelectronics 1992 International Symposium on Microelectronics, no. 52 San Francisco, CA 1992
37. R.W. Johnson, C. Wang, Y. Liu, and J.D. Scofield IEEE Transactions on Electronics Packaging Manufacturing 30 3 2007 182 193 10.1109/TEPM.2007.899158
38. P.O. Quintero, T. Oberc, and F. Patrick McCluskey HiTEC 2008, IMAPS, Albuquerque 2008 207 212
39. A. McClure, P. McCluskey, and A.J. Clark HiTEC 2008, IMAPS, Albuquerque 2008 273 278
40. M. Ciappa Microelectronics Reliability 42 4-5 2002 653 667 10.1016/S0026-2714(02)00042-2 http://www.sciencedirect.com/science/article/ B6V47-45CN6JG-8/2/9bab07a93f785fbcee637106dbe0ff07
41. K. Guth, D. Siepe, J. Görlich, H. Torwesten, R. Roth, F. Hille, and F. Umbach Proceedings of PCIM Nuremberg 2010 232 237
42. C. Mertens, J. Rudzki, and R. Sittig Proceedings of the 2004 IEEE 35th Annual Power Electronics Specialists Conference (PESC 04), IEEE Aachen 2004 4178 4182
43. CISSOID, High-Temperature, Bootstrapped Full-Bridge MOSFET Driver, datasheet, CISSOID, September 2008, http://www.cissoid.com/images/stories/pdf/ Datasheets/cht-fbdr.pdf
44. J.S. Bowers Proceedings of the 4th High Temperature Electronics Conference (HiTEC), IMAPS 1998 184 190