Pressureless Sintering of Microscale Silver Paste for 300 °C Applications

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 5, Issue 9, 2015, Pages 1258-1264

  Yu, Fang ^a   Johnson, R Wayne ^b   Hamilton, Michael C ^a  

^a AUBURN UNIVERSITY   (United States)

^b Tennessee Technological University   (United States)

Author keywords

Die attach; high temperature; reliability; sintered Ag

Indexed keywords

DIES; GOLD; HIGH TEMPERATURE APPLICATIONS; METALLIZING; METALS; RELIABILITY; SINTERING; SUBSTRATES; THICK FILMS; THIN FILMS;

DEPLETION REGION; DIE-ATTACH; DIE-ATTACH MATERIALS; FILM METALLIZATION; FILM SUBSTRATES; HIGH TEMPERATURE; HIGH-TEMPERATURE DIE-ATTACH; PRESSURE-LESS SINTERING;

SILVER;

EID: 85028228472     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2015.2455811     Document Type: Article

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