Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C

Journal of Alloys and Compounds

Volumn 687, Issue , 2016, Pages 486-498

  Chua, S T ^a   Siow, K S ^a  

^a INSTITUTE OF MICROENGINEERING AND NANOELECTRONICS IMEN   (Malaysia)

Author keywords

Diffusion; Mechanical properties; Microstructure; Nanostructured materials; Oxidation; Sintering

Indexed keywords

COPPER; DIES; DIFFUSION; INTERFACES (MATERIALS); LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; OXIDATION; PORE SIZE; POROSITY; RELIABILITY; SILVER PLATING; SINTERING; SUBSTRATES; THERMAL AGING; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

CRITICAL THICKNESS; DIE-ATTACH MATERIALS; HIGH OPERATING TEMPERATURE; HIGH TEMPERATURE STORAGE; MATCHING COEFFICIENTS; OXIDATION KINETICS; PRESSURELESS-SINTERED; THERMOMECHANICAL RELIABILITY;

SILVER;

EID: 84975886558     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2016.06.132     Document Type: Article

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