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Volumn , Issue , 2011, Pages
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Low temperature sinter technology die attachment for power electronic applications
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Author keywords
[No Author keywords available]
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Indexed keywords
AMBIENT TEMPERATURES;
AUTOMOTIVE APPLICATIONS;
BOND WIRE;
COOLING CONDITIONS;
DIE ATTACHMENT;
DIE TEMPERATURES;
ENVIRONMENTAL CONDITIONS;
HIGH VOLUME MANUFACTURING;
HIGH-POWER INVERTERS;
HYBRID CARS;
HYBRID TRUCKS;
INDUSTRIAL POWER;
JOINING TECHNOLOGY;
LOW TEMPERATURES;
OPERATION TEMPERATURE;
PACKAGE DESIGNS;
PACKAGING TECHNOLOGIES;
POWER DEVICES;
POWER ELECTRONIC APPLICATIONS;
POWER ELECTRONICS INTEGRATION;
POWER MODULE;
RELIABILITY DATA;
ULTRA-HIGH;
AUTOMOBILE ELECTRONIC EQUIPMENT;
AUTOMOBILE PARTS AND EQUIPMENT;
DIES;
DURABILITY;
ELECTRONIC EQUIPMENT MANUFACTURE;
INDUSTRIAL APPLICATIONS;
INDUSTRY;
INTEGRATION;
JOINING;
MACHINERY;
MICROPROCESSOR CHIPS;
OFF ROAD VEHICLES;
RELIABILITY;
SINTERING;
TECHNOLOGY;
WIND POWER;
POWER ELECTRONICS;
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EID: 79953755246
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (82)
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References (7)
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