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Journal of Electronic Materials

Volumn 41, Issue 9, 2012, Pages 2543-2552

Shrinkage and sintering behavior of a low-temperature sinterable nanosilver die-attach paste

(6) Wang, Tao a,b Zhao, Meihua a Chen, Xu b Lu, Guo Quan a Ngo, Khai a Luo, Shufang c

a Virginia Polytechnic Institute and State University (United States)

b TIANJIN UNIVERSITY (China)

c NBE Technologies (United States)

Author keywords

densification; interconnection; low temperature; Nanosilver paste; sintering

Indexed keywords

DENSIFICATION BEHAVIOR; DIE-ATTACH MATERIALS; INTERCONNECTION; JOINT INTERFACES; LONGITUDINAL CRACKS; LOW TEMPERATURES; MICROSTRUCTURE EVOLUTIONS; NANO SILVER; NANOMATERIAL; ORGANIC SPECIES; POWER DEVICES; SHRINKAGE BEHAVIOR; SILVER NANOPARTICLES; SINTERING BEHAVIORS; SINTERING PROCESS; TEMPERATURE PROFILES; WEIGHT LOSS; WEIGHT LOSS MEASUREMENTS;

CHIP SCALE PACKAGES; CRACKS; DENSIFICATION; SHRINKAGE; SILVER; TEMPERATURE;

SINTERING;

EID: 84865259218 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-012-2134-2 Document Type: Article

Times cited : (35)

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