Low temperature hermertic packaging with Ag sintering process

16th International Conference on Electronic Packaging Technology, ICEPT 2015

Volumn , Issue , 2015, Pages 1317-1320

  Wang, Lingen ^a  

^a Advanced Packaging Center   (Netherlands)

Author keywords

Ag sintering process; Dynamic insert control; Hemertic packaging

Indexed keywords

ELECTRONICS PACKAGING; PACKAGING; SILVER; SINTERING; SOLDERING; STRESSES; TEMPERATURE; WELDING;

CONTROL TECHNOLOGIES; PROCESS TEMPERATURE; REAL-TIME DYNAMICS; SINTERING PROCESS; TEMPERATURE SENSITIVE; THERMO-MECHANICAL STRESS; UNIFORM MICROSTRUCTURE; WELDING TEMPERATURES;

PROCESS CONTROL;

EID: 84957809834     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2015.7236821     Document Type: Conference Paper

References (4)

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3. Kim S. Siow, "Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?", Journal of ELECTRONIC MATERIALS, Vol. 43, No. 4, 2014, p947-961.
4. S. Millar, M. P. Y. Desmulliez, S. McCracken2, "Review of test methods used for the measurement of hermeticity in packages containing small cavities", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2 (3), 2011, p430-438.