Spark Plasma Sintering constrained process parameters of sintered silver paste for connection in power electronic modules: Microstructure, mechanical and thermal properties

Materials Chemistry and Physics

Volumn 148, Issue 1-2, 2014, Pages 125-133

  Alayli, N ^a,b   Schoenstein, F ^a   Girard, A ^c   Tan, K L ^d   Dahoo, P R ^b  

^a UNIVERSITÉ PARIS 13   (France)

^b LABORATOIRE DES SCIENCES DU CLIMAT ET DE L ENVIRONNEMENT   (France)

^c ONERA   (France)

^d VALEO   (France)

Author keywords

Electrical conductivity; Mechanical properties; Nanostructures; Powder metallurgy; Sintering; Thermal conductivity

Indexed keywords

AUTOMOTIVE INDUSTRY; CHIP SCALE PACKAGES; CRYSTALLITE SIZE; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; NANOSTRUCTURES; POWDER METALLURGY; POWER ELECTRONICS; SCANNING ELECTRON MICROSCOPY; SILVER; SINTERING; SPARK PLASMA SINTERING; SUBSTRATES;

ELECTRICAL CONDUCTIVITY; MECHANICAL AND THERMAL PROPERTIES; MORPHOLOGICAL PROPERTIES; NANO-STRUCTURED SILVERS; POWER ELECTRONIC DEVICES; POWER ELECTRONIC MODULES; THERMAL AND ELECTRICAL PROPERTIES; THERMOMECHANICAL PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 84908164753     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2014.07.021     Document Type: Article

References (35)

1. R.R. Tummala, P. Garrou, T.K. Gupta, N. Kuramoto, K. Niwa, Shimada, and Y. Terasawa Microelectronics Packaging Handbook: Semiconductor Packaging Part II 1997 Chapman & Hall New York 285 293
2. M. Knoerr, and A. Schlettz Power semiconductor joining through sintering of silver nanoparticles: evaluation of influence of parameters time, temperature and pressure on density, strength and reliability Proceedings of the CIPS Conference, Nuremberg, Germany 2010 1 6
3. Directive of the European Parliament Directive of the european parliament and of the council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Directive 2002/95/EC Off. J. Eur. Union L 037 2003 19 23
4. S. Rane, V. Puri, and D. Amalnerkar A study on sintering and microstructure development of fretless silver thick film conductors J. Mater. Sci. Mater. Electron. 11 2000 667 674
5. C.R. Chang, and J.H. Jean Effects of silver-paste formulation on camber development during the cofiring of a silver-based, low temperature co fired ceramic package J. Am. Ceram. Soc. 81 1998 2805 2814
6. A.D. Kirshenbaum, J.A. Cahill, and A.V. Grosse J. Inorg. Nucl. Chem. 24 1962 333 336
7. Z. Zhang, and G.Q. Lu Pressure-assisted low temperature sintering of silver paste as an alternative die-attach solution to solder reflow IEEE Trans. Electron. Packag. Manuf. 25 2002 279 283
8. P.R. Dahoo, N. Alayli, A. Girard, P. Pougnet, K.L. Tan, and J.M. Morelle Reliability in mechatronic systems from TEM, SEM and SE material analysis Materials Research Society, Symposium Proceedings, Boston, Massachusetts, USA vol. 1195 2009 ref. 1195-B07-04
9. H. Schwarzbauer, Method of Securing Electronic Components to a Substrate, U.S. Patent 4,810,672.
10. H. Schwarzbauer, and R. Kuhnert Novel large area joining technique for improved power device performance IEEE Trans. Ind. Appl. 27 1991 93 95
11. R.W. Chuang, and C.C. Lee Silver-indium joints produced at low temperature for high temperature devices IEEE Trans. Compon. Packag. Manuf. Technol. 25 2002 453 458
12. Z.Z. Zhang, J. Bai, G.-Q. Lu, J. Yin, J.D. Van Wyk, Z. Liang, L. Zhu, and T.P. Chow Low-temperature sintering nanoscale silver paste as an high temperature packaging solution Proceedings of the International Conference on Power Electronics USA 2005
13. M.L. Salvatore Grasso, Y. Sakka, and G. Maizza Electric current activated/assisted sintering (ECAS): a review of patents 1906-2008 Sci. Technol. Adv. Mater. 10 2009 053001
14. Y. Fu, C. Shearwood, B. Xu, L. Yu, and K. Khor Characterization of spark plasma sintered Ag nanopowders Nanotechnol 21 2010 115707
15. Y. Mei, Y. Cao, G. Chen, X. Li, G.-Q. Lu, and X. Chen Rapid sintering nanosilver joint by pulse current for power electronic packaging IEEE Trans. Device Mater. Reliab. 13 2013 258 265
16. Y. Mei, Y. Cao, G. Chen, X. Li, G. Lu, and X. Chen Characterization and reliability of sinter nanosilver joints by a rapid current-assisted method for power electronic packaging IEEE Trans. Device Mater. Reliab. 14 2014 262 267
17. Kim S. Siow Are sintered silver joints ready for use as interconnect material in microelectronic packaging? J. Electron. Mater. 43 2014 947 961
18. S. Imine, F. Schoenstein, S. Mercone, M. Zaghrioui, N. Bettahar, and N. Jouini Bottom-up and new compaction processes: a way to tunable properties of nanostructured cobalt ferrite ceramics J. Eur. Ceram. Soc. 31 2011 2943 2955
19. A. Teber, F. Schoenstein, F. Tetard, M. Abdellaoui, and N. Jouini Effect of SPS process sintering on the microstructure and mechanical properties of nanocrystalline TiC for tools application Int. J. Refract. Met. Hard Mater. 30 2012 64 70
20. F. Fellah, G. Dirras, J. Gubicza, F. Schoenstein, N. Jouini, S.M. Cherif, C. Gatel, and J. Douin Microstructure and mechanical properties of ultrafine-grained fcc/hcp cobalt processed by a bottom-up approach J. Alloys Compd. 489 2010 424 428
21. A. Dakhlaoui Omrani, M. Bousnina, L.S. Smiri, M. Taibi, P. Leone, F. Schoenstein, and N. Jouini Elaboration of nickel nanoparticles by modified polyol process and their spark plasma sintering, characterization and magnetic properties of the nanoparticles and the dense nano-structured material Mater. Chem. Phys. 123 2010 821 828
22. K.C. Otiaba, N.N. Ekere, R.S. Bhatti, S. Mallik, M.O. Allam, and E.H. Amalu Thermal interface materials for automotive electronic control unit: trends, technology and R&D challenges Microelectron. Reliab. 51 2011 2031 2043
23. O.V. Gendelman, M. Shapiro, Y. Estrin, R.J. Hellmig, and S. Lekhtmakher Grain size distribution and heat conductivity of copper processed by equal channel angular processing Mater. Sci. Eng. A 434 2006 88 94
24. G.K. Williamson, and W.H. Hall X-ray line broadening from filed aluminium and wolfram Acta Metall. 1 1953 22 31
25. B. Hay, J.R. Filtz, J. Hameury, and L. Rongione Uncertainty of thermal diffusivity measurements by laser flash method Int. J. Thermophys. 26 2005 1883 1898
26. N. Alayli Sintering of Silver Paste with Micro and Nano Inclusions for Interconnection in a Mechatronics Power Module: Preparation, Characterization and Implementation Ph.D. dissertation 2011 University of Versailles St Quentin en Yvelines
27. 3 on STO (001) J. Appl. Phys. 102 2007 063709
28. J.G. Santanach, A. Weibel, C. Estournès, Q. Yang, C. Laurent, and A. Peigney Spark plasma sintering of alumina: study of parameters, formal sintering analysis and hypotheses on the mechanism(s) involved in densification and grain growth Acta Mater. 59 2011 1400 1408
29. Z.A. Munir, U. Anselmi-Tamburini, and M. Ohyanagi The effect of electric field and pressure on the synthesis and consolidation of materials: a review of the spark plasma sintering method J. Mater. Sci. 41 2006 763 777
30. Y. Chen, B.L. Dorgan, D.N. McIlroy, and D.E. Aston On the importance of boundary conditions on nanomechanical bending behavior and elastic modulus determination of silver nanowires J. Appl. Phys. 100 2006 104301
31. G.K. White, and J.G. Collins Thermal expansion of copper, silver, and gold at low temperatures J. Low Temp. Phys. 7 1972 43 75
32. Y. Okada, and Y. Tokumaru Precise determination of lattice parameter and thermal expansion coefficient of silicon between 300 and 1500 K J. Appl. Phys. 100 1984 314 320
33. J.G. Bai, Z.Z. Zhang, J.N. Calata, and G.Q. Lu Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material IEEE Trans. Compon. Packag. Manuf. Technol. 29 2006 589 593
34. J. Kähler, N. Heuck, A. Stranz, A. Waag, and E. Peiner Pick-and-place silver sintering die attach of small-area chips IEEE Trans. Compon. Packag. Manuf. Technol. 2 2012 199 207
35. G. Wiedemann, and R. Franz Annalen der Physik 165 1853 497 531