Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Microelectronics Reliability

Volumn 55, Issue 9-10, 2015, Pages 1997-2002

  Youssef, T ^a,e   Rmili, W ^b   Woirgard, E ^a   Azzopardi, S ^c   Vivet, N ^d   Martineau, D ^e   Meuret, R ^e   Le Quilliec, G ^b   Richard, C ^b  

^a UNIVERSITÉ DE BORDEAUX   (France)

^b UNIVERSITÉ DE TOURS   (France)

^c UNIVERSITÉ BORDEAUX 1   (France)

^d STMICROELECTRONICS   (France)

^e SAFRAN AIRCRAFT ENGINES   (France)

Author keywords

Anand model; Nano crystalline silver sintering; Porosity; Strain energy density; Thermal conductivity; Young's modulus

Indexed keywords

ELASTIC MODULI; ELECTRONICS PACKAGING; GREENHOUSE GASES; NANOCRYSTALLINE POWDERS; NANOCRYSTALS; POROSITY; SILVER; STRAIN ENERGY; THERMAL CONDUCTIVITY;

ANAND MODEL; HIGH MELTING POINT; LEAD-BASED SOLDERS; NANOCRYSTALLINES; PROCESSING ROUTE; SINTERING PROCESS; STRAIN ENERGY DENSITY; THERMAL AND ELECTRICAL CONDUCTIVITY;

SINTERING;

EID: 84943454412     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2015.06.085     Document Type: Article

References (9)

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