Characterization of nanosilver dry films for high-temperature applications

IEEE Transactions on Device and Materials Reliability

Volumn 15, Issue 2, 2015, Pages 149-155

  Khazaka, R ^a,b   Thollin, B ^a   Mendizabal, L ^a   Henry, D ^a   Hanna, R ^c  

^a UNIV GRENOBLE ALPES   (France)

^b UNIVERSITÉ DE TOURS   (France)

^c LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

Author keywords

High temperature; Nano silver paste; Reliability; Shear strength; Sintering; Transient thermal impedance

Indexed keywords

ACOUSTIC IMPEDANCE; HIGH TEMPERATURE APPLICATIONS; RELIABILITY; SHEAR STRENGTH; SINTERING; THERMAL CYCLING;

HIGH OPERATING TEMPERATURE; HIGH TEMPERATURE; HIGH TEMPERATURE STORAGE; LOW PROCESS TEMPERATURE; NANO-SILVER PASTES; SINTERING TEMPERATURES; THERMOMECHANICAL RELIABILITY; TRANSIENT THERMAL IMPEDANCES;

THERMAL CONDUCTIVITY;

EID: 84941655537     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2015.2402294     Document Type: Article

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