Review on joint shear strength of nano-silver paste and its long-term high temperature reliability

Journal of Electronic Materials

Volumn 43, Issue 7, 2014, Pages 2459-2466

  Khazaka, R ^a   Mendizabal, L ^a   Henry, D ^a  

^a CEA GRENOBLE   (France)

Author keywords

electro migration; Nano silver paste; pressure; reliability; shear strength; sintering

Indexed keywords

ATMOSPHERIC TEMPERATURE; LEAD-FREE SOLDERS; MATERIALS PROPERTIES; PRESSURE; RELIABILITY; SHEAR STRENGTH; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING; STRESSES; THERMAL CONDUCTIVITY;

HIGH OPERATING TEMPERATURE; HIGH THERMAL CONDUCTIVITY; HIGH-TEMPERATURE ELECTRONICS; JOINT SHEAR STRENGTHS; LOW PROCESS TEMPERATURE; NANO-SILVER PASTES; THERMO-MECHANICAL STRESS; THERMOMECHANICAL RELIABILITY;

SINTERING;

EID: 84901934037     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-014-3202-6     Document Type: Review

References (52)

1. S. Kyung-ah, L. Anna, L. Gerald, G. Manuel, H. Toshiro, H. Richard, S. Leif, and S. William, Nanosci. Nanotechnol. Lett. 2, 332-336 (2010).
2. T. Funaki, J.C. Balda, J. Junghans, A.A. Kashyap, F.D. Barlow, H.A. Mantooth, T. Kimoto, and T. Hikihara, IEICE Electron. Express 1, 523-527 (2004).
3. C. Buttay, A. Masson, J. Li, M. Johnson, M. Lazar, C. Raynaud, and H. Morel, Die Attach of Power Devices Using Silver Sintering Bonding Process Optimization and Characterization, IMAPS High Temperature Electronics Network HITEN, (Oxford, 2011).
4. M. Knoerr, S. Kraft, and A. Schletz, Reliability Assessment of Sintered Nano-Silver Die Attachment for Power Semiconductors, 12th Electronics Packaging Technology Conference, (Singapore, 2010).
5. S.J. Pearton, J.C. Zolper, R.J. Shul, and F. Ren, J. Appl. Phys. 86, 683-691 (1999).
6. P. Neudeck, R. Okojie, and L. Chen, Proc. IEEE 90, 1065-1076 (2002).
7. L.A. Navarro, X. Perpiñà, M. Vellvehi, and X. Jordà, Ingenieria Mecanica Technologia Y Desarollo 4, 97-102 (2012).
8. C. Huang, M.F. Becker, J.W. Keto, and D. Kovara, J. Appl. Phys. 102, 054308 (2007).
9. T. Wang, X. Chen, G.Q. Lu, and G.Y. Lei, J. ElecTron. Mater. 36, 1333-1340 (2007).
10. M. Jakubowsk, M. Jarosz, K. Kiełbasinski, and A. MłoZniak, Microelectron. Reliab. 51, 1157-1282 (2011).
11. S. Joo and D. F. Baldwin, Electron. Compon. Technol. Conf. 1417-1423 (2008).
12. D.R. Lide, CRC Hand Book of Chemistry and Physics, 79th ed. (Boca Raton: CRC Press, 1999).
13. M. Tobita, Y. Yasuda, E. Ide, J. Ushio, and T. Morita, J. Nanopart. Res. 12, 2135-2144 (2010).
14. A.J. Murray, P. Jaroenapibal, and B. Koene, Mater. Res. Soc. Symp. Proc. 942, 39-44 (2006).
15. G-Q. Lu, J.N. Calata, and G. Lei, IEEE 8th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, (EuroSime, 2007), pp. 609-613.
16. J. Guofeng Bai and G.-Q. Lu, IEEE Trans. Device Mater. Reliab. 6, 436-441 (2006).
17. Y. Mei, D. Ibitayo, X. Chen, S. Luo, and G-Q. Lu, IMAPS International Conference and Exhibition on High Temperature Electronics (HITEC, 2010).
18. P. Ning, (Ph.D. thesis at the faculty of the Virginia Polytechnic, 2010).
19. J.R. Groza, Nanostructured Materials: Processing, Properties and Potential Applications, ed. C.C. Koch (Norwich: Noyes Publication, 2002)
20. J. Yan, G. Zou, A. Wu, J. Ren, J. Yan, A. Huc, and Y. Zhoua, Scripta Mater. 66, 582-585 (2012).
21. T.G. Lei, J. Calata, G.-Q. Lu, X. Chen, and S. Luo, IEEE Trans. Compon. Packag. Technol. 33, 98-104 (2010).
22. M. Knoerr and A. Schletz, International Conference on Integrated Power Electronics CIPS, (Nurenberg Gremany, 2010).
23. E. Ide, S. Angata, A. Hirose, and K.F. Kobayashi, Acta Mater. 53, 2385-2393 (2005).
24. K.S. Siow, J. Alloy. Compd. 514, 6-19 (2012).
25. Z. Zhang and G.-Q. Lu, IEEE Trans. Electron. Packag. Manuf. 25, 3-10 (2002).
26. E.A. Holm, J.D. Puskar, M. Reece, V. Tikare, G.C. Cardona, and L.N. Brewer, Nanocrystal Enabled Solid State Bonding, Report SAND2010-7013, (Sandia National Laboratories, 2010).
27. Y. Morisada, T. Nagaoka, M. Fukusumi, Y. Kashiwagi, M. Yamamoto, and M. Nakamoto, J. Electron. Mater. 39, 1283-1288 (2010).
28. G. Zou, J. Yan, F. Mu, A. Wu, J. Ren, A. Hu, and Y. Norman Zhou, Open Surf. Sci. J. 3, 70-75 (2011).
29. J.G. Bai, T.G. Lei, J.N. Calata, and G.-Q. Lu, J. Mater. Res. 22, 3494-3500 (2007).
30. M. Knoer, A. Schletz, S. Oertel, and M. Jank, Proceeding of the World Congress on Particle Technology WCPT6, (2010).
31. H. Ogura, M. Maruyama, R. Matsubayashi, T. Ogawa, S. Nakamura, T. Komatsu, H. Nagasawa, A. Ichimura, and S. Isoda, J. Electron. Mater. 39, 1233-1240 (2010).
32. K. Qi, X. Chen, and G.Q. Lu, Polym. Eng. Sci. 20, 29-36 (2008).
33. P. Panaccionel, T. Wang, X. Chen, S. Luo, and G-Q. Lu, Presented at the 6th International Conference and Exhibition on Device Packaging, (Arizona, USA, 2010).
34. Y. Mei, Y. Cao, G. Chen, X. Li, G.-Q. Lu, and X. Chen, IEEE Trans. Device Mater. Reliab. 13, 258-265 (2013).
35. N. Heuck, S. Muller, G. Palm, A. Bakin, and A. Waag, IMAPS International Conference and Exhibition on High Temperature Electronics (HITEC), (2010).
36. G. Chen, Y. Cao, Y. Mei, D. Han, G.-Q. Lu, and X. Chen, IEEE Trans. Compon. Packag. Manuf. Technol. 2, 1759-1767 (2012).
37. S. Chul Joo, (Ph.D. thesis, Georgia Institute of Technology, 2009).
38. P. Ning, G. Lei, F. Wang, G.-Q. Lu, K. Ngo, and K. Rajashekara, IEEE Trans. Power Electron. 25, 16-23 (2010).
39. M. Trunov and M. Schoenitz, Combust. Flame 140, 310-318 (2005).
40. H.L. Wang and M.H. Hon, Ceram. Int. 25, 267-271 (1999).
41. X. Li, X. Chen, D. Yu, and G-Q. Lu, 11th International Conference on Electronic Packaging Technology & High Density Packaging (2010).
42. J. Li, (MSc thesis, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, 2010).
43. G. Q. Lu, Nanosilver Paste: An Enabling Nanomaterial for Low Temperature Joining of Power Device. The Applied Power Electronic Conference (APEC, Fort Worth TX, 2011).
44. D. Yu, X. Chen, G. Chen, G. Lu, and Z. Wang, Mater. Des. 30, 4574-4579 (2009).
45. X. Chen, R. Li, K. Qi, and G.Q. Lu, J. Electron. Mater. 37, 1574-1579 (2008).
46. J.G. Bai, Z.Z. Zhang, J.N. Calata, and G.Q. Lu, IEEE Trans. Compon. Packag. Technol. 29, 589-593 (2006).
47. A. Hornung, Proceedings of the Electronic Components Conference, (1968), pp. 250-255.
48. G.J. Kahan, IEEE Trans. Electron. Insul. EI-10, 86-94 (1975).
49. J. J. Gagne, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-5, (1982).
50. Y. Mei, G.-Q. Lu, X. Chen, S. Luo, and D. Ibitayo, IEEE Trans. Device Mater. Reliab. 11, 316-322 (2011).
51. D.R. Gaskell, Introduction to the Thermodynamics of Materials, 4th ed. (New York: Taylor & Francis, 2003).
52. P. E. Henson, (Master thesis, Auburn university, Alabama, 2010).