Chip-bonding on copper by pressureless sintering of nanosilver paste under controlled atmosphere

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 3, 2014, Pages 377-384

  Zheng, Hanguang ^a   Berry, David ^a   Ngo, Khai D T ^a   Lu, Guo Quan ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

Chip bonding; controlled atmosphere; copper surface; nanosilver paste; pressureless sintering

Indexed keywords

BOND STRENGTH (CHEMICAL); COPPER; DIFFUSION BONDING; HYDROGENATION; MICROSTRUCTURE; NITROGEN; PROTECTIVE ATMOSPHERES; SILVER; SUBSTRATES;

CATALYTIC HYDROGENATION; CHIP-BONDING; COPPER SURFACE; FORMATION-OF-COPPER OXIDES; MICROSTRUCTURE CHARACTERIZATION; NANO-SILVER PASTES; PRESSURE-LESS SINTERING; SINTERING TEMPERATURES;

SINTERING;

EID: 84896330205     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2296882     Document Type: Article

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