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Volumn , Issue , 2011, Pages
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Novel silver contact paste lead free solution for die attach
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING PROCESS;
DIE-ATTACH APPLICATIONS;
JOINING TECHNOLOGY;
LEAD-FREE;
LOW PRESSURES;
LOW TEMPERATURES;
MICRO-SCALES;
NANO SILVER;
NOVEL CONCEPT;
PRESSURELESS;
SILVER CONTACTS;
SILVER PARTICLES;
SILVER PASTES;
DIES;
ELECTRIC PROPERTIES;
JOINING;
ORGANIC POLYMERS;
POWER ELECTRONICS;
SHEAR STRENGTH;
SINTERING;
SILVER;
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EID: 79953753629
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (12)
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References (6)
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