Influence of nanoparticles content in silver paste on mechanical and electrical properties of LTJT joints

Advanced Powder Technology

Volumn 26, Issue 3, 2015, Pages 907-913

  Kiełbasiński, Konrad ^a   Szałapak, Jerzy ^b   Jakubowska, Małgorzata ^a,b   Młozniak, Anna ^a   Zwierkowska, Elzbieta ^a   Krzemiński, Jakub ^b   Teodorczyk, Marian ^a  

^a ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Die bonding; Electrical properties; Low temperature sintering; Shear strength; Silver nano powder

Indexed keywords

BINARY ALLOYS; ELECTRIC PROPERTIES; JOINING; LEAD ALLOYS; METAL NANOPARTICLES; MIXING; POROSITY; SHEAR STRENGTH; SINTERING; TEMPERATURE; TIN ALLOYS;

DIE BONDING; HIGH SURFACE ENERGY; LIMITED VENTILATION; LOW-TEMPERATURE SINTERING; MECHANICAL AND ELECTRICAL PROPERTIES; MICRO AND NANO-PARTICLE; NANO POWDERS; SINTERING TEMPERATURES;

SILVER NANOPARTICLES;

EID: 84931568289     PISSN: 09218831     EISSN: 15685527     Source Type: Journal    
DOI: 10.1016/j.apt.2015.03.007     Document Type: Article

References (15)

1. Test Method Standard Microcircuits, Standard MIL-STD-883H, 2010. < http://snebulos.mit.edu/projects/reference/MIL-STD/MIL-STD-883H-1000.pdf >.
2. U. Scheuermann, Low-temperature joining technology a high reliability alternative to solder contacts, in: Proc. Workshop Metal Ceramic Composites Functional Applicat., Vienna, Austria, 1997. < https://www.etde.org/etdeweb/servlets/purl/348289-4Kz5F4/webviewable/ >.
3. M. Knoerr, S. Schletz, Power Semiconductor Joining through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters, Time, Temperature and Pressure on Density, Strength and Reliability, (CIPS Nuremberg, Germany, 2010). < http://www.iisb.fraunhofer.de/content/dam/iisb/de/documents/geschaeftsfelder/leistungselektronische-systeme/veroeffentlichungen/CIPS-2010-Knoerr.pdf >.
4. S. Sakamoto, K. Suganuma, Low temperature die-bonding with Ag flakes, (EMPC 2011). < http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6142398 >.
5. D. Wakuda, K.-S. Kim, and K. Suganuma IEEE Trans. Comp. Packag. Technol. 2010 10.1109/TCAPT.2009.2031680
6. C. Buttay, A. Masson, J. Li, M. Johnson, M. Lazar, C. Raynaud, H. Morel, Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimisation and Characterization, (HiTEN 2011). < http://hal.archives-ouvertes.fr/docs/00/67/26/19/PDF/article.pdf >.
7. M. Jakubowska, M. Jarosz, K. Kiełbasinski, and A. Młozniak Microelectron. Reliab. 2011 10.1016/j.microrel.2011.04.015
8. Kyoung-Sik Moon, Hai Dong, Radenka Maric, Suresh Pothukuchi, Andrew Hunt, Yi Li, and C.P. Wong Thermal behavior of silver nanoparticles for low-temperature interconnect applications J. Electron. Mater. 34 2 2005
9. R.M. German Prediction of sintered density for bimodal powder mixtures Metall. Trans. A 23 5 1992 1455 1465
10. David C.C. Lam, and Mitsuo Nakagava Effect of particle size distribution shape in bimodal packing Adv. Mater. '93: Ceram., Powders, Corros. Adv. Process. 1993
11. H.J.H. Brouwers Particle-size distribution and packing fraction of geometric random packings Phys. Rev. E 74 2006 031309
12. M. Jakubowska, A. Młozniak, M. Jarosz, EP11173430.7, 2011.
13. N.B. Bell, C.B. DiAntonio, and D.B. Dimos J. Mater. Res. 17 2002 2423 2432
14. J.G. Bai, Z.Z. Zhang, J.N. Calata, G.-Q. Lu, in: Proc. High Density Microsystem Design and Packaging and Component Failure Analysis, 2005, http://dx.doi.org/10.1109/HDP.2005.251412.
15. T.G. Lei, J.N. Calata, G.Q. Lu, Xu Chen, and S. Luo IEEE Trans. Comp. Packag. Technol. 2010 10.1109/TCAPT.2009.2021256