Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

Microelectronics Reliability

Volumn 55, Issue 12, 2015, Pages 2524-2531

  Zhao, Su Yan ^a   Li, Xin ^a   Mei, Yun Hui ^a   Lu, Guo Quan ^a,b  

^a TIANJIN UNIVERSITY   (China)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Bare copper plate; Bonding strength; Interface reaction; Nano silver paste; Thermal aging

Indexed keywords

BONDING; COPPER; COPPER PLATING; DIFFUSION BONDING; LEAD; LEAD-FREE SOLDERS; MICROELECTRONICS; SINTERING; THERMAL AGING;

BONDING STRENGTH; DIE-ATTACH MATERIALS; ELEVATED TEMPERATURE; INTERFACE REACTIONS; MICROELECTRONIC PACKAGING; NANO-SILVER PASTES; TEMPERATURE OPERATION; THERMAL AND ELECTRICAL CONDUCTIVITY;

SILVER;

EID: 84949678544     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2015.10.017     Document Type: Conference Paper

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