Critical issues of 3D high-performance IC integrations

Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Volumn , Issue , 2009, Pages 585-592

  Lau, John H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

3D IC integration; MEOL; Solder microbumps; Thermal management; Thin wafer handling; TSV with RDL

Indexed keywords

HIGH-PERFORMANCE IC; MEOL; MICRO-BUMPS; MICROELECTRONIC INDUSTRY; POTENTIAL SOLUTIONS; RESEARCH PROBLEMS; THIN WAFERS; TSV WITH RDL;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; INTEGRAL EQUATIONS; INTEGRATION; MICROELECTRONICS; PROGRAMMABLE LOGIC CONTROLLERS; TEMPERATURE CONTROL;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 77955210944     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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