Design and process of 3D MEMS packaging

Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Volumn , Issue , 2009, Pages 1-9

  Lau, John H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

3D IC integration; Low temperature bonding; MEMS; SiP; TSV; Wafer level packaging

Indexed keywords

ASSEMBLY PROCESS; DESIGN AND ASSEMBLIES; ELECTRICAL PERFORMANCE; LOW TEMPERATURE BONDING; SIP; THROUGH-SILICON-VIA; TSV; WAFER LEVEL PACKAGING;

ASSEMBLY; BONDING; CHIP SCALE PACKAGES; ETCHING; FLIP CHIP DEVICES; MEMS; MICROELECTRONICS; THREE DIMENSIONAL COMPUTER GRAPHICS;

WAFER BONDING;

EID: 77955220633     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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