Isotropic conductive adhesive interconnect technology in electronics packaging applications

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 45-52

  Morris, James E ^a   Lee, Jeahuck ^a   Liu, Johan ^b,c  

^a Department of Electrical and Computer Engineering   (United States)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROELECTRONICS; PHOTONS; SOLDERING;

INTERCONNECT TECHNOLOGY; ISOTROPIC CONDUCTIVE ADHESIVES (ICA);

ADHESIVES;

EID: 33847226270     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596485     Document Type: Conference Paper

References (120)

1. Zwolinski, M., IEEE Trans-CPMT Part C, Vol. 19, No. 4 (1996), pp. 241-250.
2. Detert, M. & Herzog, Th., Proc 49th Electronic Components and Technology Conf, San Diego, CA, (1999).
3. Liu, J., Ljungkrona, L. & Lai, Z., IEEE Transactions on Components, Packaging & Manufacturing Technology Part B. Vol. 18, No. 2 (1995), pp. 313-319.
4. Rörgren, R. & Liu, J., IEEE Transactions on Components, Packaging & Manufacturing Technology Part B. Vol. 18, No. 2 (1995), pp. 305-312.
5. Gaynes, M., Lewis, R., Saraf, R. & Roldan, J., IEEE Transactions on Components, Packaging & Manufacturing Technology Part B. Vol. 18, No. 2 (1995), pp. 299-304.
6. Rusanen, O. & Lenkkeri, J., IEEE Transactions on Components, Packaging & Manufacturing Technology Part B. Vol. 18, No. 2 (1995), pp. 320-325.
7. Hvims, H., IEEE Transactions on Components, Packaging & Manufacturing Technology Part B. Vol. 18, No. 2 (1995), pp. 284-291.
8. Li, L. & Morris, J. E., International Journal of Microelectronic Packaging, Vol. 1, No. 3, (1998), 159-175.
9. Liu, J. & Morris, J. E., Proc. Workshop Polymeric Materials for Microelectronics & Photonics Applications, EEP-Vol. 27, ASME, (1999), pp. 259-281.
10. Morris, J. E. & Liu, J., Electrically Conductive Adhesives (ECAs), in press. (E. Suhir, Y.C Lee, & C. P. Wong, editors).
11. Liu, J. editor, Conductive Adhesives for Electronics Packaging, Electrochemical Publications Ltd, 1999, UK.
12. th Electronic Components & Technology Conf., Las Vegas, (2000).
13. Morris, J. E. in "Electrically Conductive Adhesives: A Comprehensive Review", J. Liu, ed., Electrochemical Press, UK, (1999) pp. 37-77.
14. Smilauer, P., Contemp. Phys. Vol. 32, (1991), pp, 89-102.
15. Li, L., Kim, H., Lizzul, C., Sacolick, I., & Morris, J. E., IEEE Trans-CPMT, Vol. 16, (1993), pp. 843-851.
16. Kusy, R. P., J. Appl. Phys. Vol. 48, (1977), pp. 5301-5305.
17. Li, L. & Morris, J. E., IEEE Trans-CPMT- A Vol. 20, No. 1 (1997), pp. 3-8.
18. rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton, NY, (1998), pp. 90-95.
19. Ruschau, G. R., Yoshikawa, S. & Newnham, R. E., Proc. 42nd Electronic Components & Technology Conference, (1992), Atlanta GA, pp. 481.
20. th International Spring Seminar on Electronics Technology, Stara, Lesna, Slovak Republic, (2003), pp. 90-94.
21. Constable, J., Kache, T., Teichmann, H., Mühle, S. & Gaynes, M., IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 2 (1999), pp. 191-199.
22. Morris, J. E., Anderssohn, F., Kudtarkar, S. & Loos, E. Proc. l" International Conference Polymers & Adhesives in Microelectronics & Photonics, Potsdam, Germany, (2001), pp. 61-69.
23. ad International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, (1996), pp. 14-17 & 55-59.
24. Li, L. & Morris, J. E., Journal of Electronics Manufacturing, Vol. 5, No. 4, (1995), pp. 289-296.
25. Mundlein, M. & Nicolics, J., Proc. 4th International Conference. Polymers & Adhesives in Microelectronics & Photonics, Portland, Oregon, (2004), PP-3.
26. rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY, (1998), pp. 84-89.
27. th IEEE Electronic Components & Technol. Conference, San Diego, (1999).
28. nd International IEEE Conference Polymers & Adhesives in Microelectronics & Photonics, Zalaegerszeg, Hungary, pp. 68-72.
29. Li, L. & Morris, J. E., Jounal of Electronics Manufacturing, Vol. 5, No. 4, (1996), pp.289-298
30. Dong, H., Moon, K. & Wong, C. P., Journal of Electronic Materials, Vol. 34, No. 1 (2005), pp. 40-45.
31. Klosterman, D., Li, L. & Morris, J. E., IEEE Trans-CPMT-A, Vol. 21, No. 1, (1998), pp. 23-31.
32. rd International IEEE Conference Polymers & Adhesives in Microelectronics & Photonics, Montreux, Switzerland, (2003), pp. 333-336.
33. Shimada, Y., Lu, D. & Wong, C. P., Journal of Electronics Manufacturing, Vol. 10, No. 2 (2000), pp. 97-103.
34. Wu, S., Hu, K. & Yeh, C., in Conductive Adhesives for Electronics Packaging, (edited by Johan Liu), Electrochemical Publications Ltd, UK, 1998, pp. 117-150.
35. Dernevik, M., Sihlbom, R., Lai, Z., Starski, P. & Liu, J. Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, Kohala Coast, Hawaii, (1997).
36. Sihlbom, R., Dernevik, M., Lai, Z., Starski, P. & Liu, J., Proc. Polymeric Electronics Packaging Conference, Norrköping, Sweden, (1997).
37. nd International Symposium Polymeric Electronics Packaging (PEP'99), Gothenburg, Sweden, (1999), pp. 15-25.
38. st Electronic Components and Technology Conference, Orando, FL (2001).
39. Behner, U., Haug, R., Schutz, R. & Hartnagel, H. L. Polymers in Electronics Packaging Conference, Norrkoping, Sweden, (1997), 243-248.
40. Vandamme, I., Perichaud, M., Noguera, E., Danto, Y. & Buehner, U., IEEE Trans-CPMT, Vol. 22, No. 3, (1999), pp. 446-454.
41. Suzuki, K., Suzuki, O. & Komagata, M., IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A, Vol. 21, No. 2 (1998), pp. 252-258.
42. Herzog, T., Koehler, M. & Woher, K-J., Proc. 2004 Electronic Components & Technology Conference, Las Vegas, pp. 1136-1141.
43. nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, (1996), pp. 76-83.
44. th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, (2000), pp. 41-45.
45. rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY, (1998), pp. 55-61.
46. th International Spring Seminar Electronics Technology, Romania, (2001), pp. 37-41.
47. th International Symposium on Advanced Packaging Materials, Braselton, GA, (2002), pp. 260-270.
48. th International Symposium on Advanced Packaging Materials, Braselton, GA, (2002), pp. 127-131.
49. Kuechenmeister, F. & Meusel, E., IEEE Transactions on Components, Packaging & Manufacturing Technology Part A. Vol. 20, No. 1 (1997), pp. 9-14.
50. Keil, M., Bjarnason, B., Wickstrom, B. & Olsson, L., Adavanced Packaging September, 2001.
51. 51.Gupta, S., Hydro, R. & Pearson, R., IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 2, (1999), pp. 209-214.
52. Sihlbom, S., Sihlbom, R. & Liu, J., Electronic Packaging Technology Conference, December 8-10, (1998), Singapore.
53. Lu, D., Tong, Q. K. & Wong C. P., IEEE Transactions on Components and Packaging Technologies, Vol. 22, No. 3, (1999), pp. 365-371.
54. Markley, D. L., Tong, Q. K., Magliocca, D. J. & Hahn, T.D., International Symposium on Advanced Packaging Materials, Processes, Properties and Interfaces, (1999), pp. 16-20.
55. th international Symposium on Advanced Packaging Materials, Braselton, OA, (2000), pp. 336-342.
56. Kottaus, S., Guenther, B. H., Haug, R. & Scheafer, H., IEEE Trans-CPMT Part A, Vol. 20, No. 1, (1997), pp. 15-20.
57. Lu, D. & Wong, C. P., International Symposium on Advanced Packaging Materials, Porterin, Isle of Man British Isles, (2000), pp. 336-341.
58. Marshall, D. W., Journal of Adhesion, Vol. 74, No. 1-4, (2000), pp. 301-315.
59. Lu, D. & Wong, C. P., Journal of Thermal Analysis and Calorimetry, Vol. 59, (2000), pp. 729-740.
60. Lu, D. & Wong, C. P., Journal of Thermal Analysis and Calorimetry, Vol. 61, (2000), pp. 3-12.
61. Wong, C. P. & Li, Y., Proc. 4th International Conf. Polymers & Adhesives in Microelectronics & Photonics, Portland, Oregon, (2004), PL-1.
62. th Electronic Components and Technology Conference., Las Vegas, NV (2004) pp. 1959-1964.
63. th IEEE CPMT Conf. High Density Microsystem Design and Packaging & Component Failure Analysis (HDP'04), Shanghai, (2004), pp. 236-241.
64. rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY, (1998), 184-192.
65. th International Symposium Advanced Packaging Materials, Atlanta, GA, (2002), pp. 132-138.
66. Kim, J., Yasuda, K. & Fujimoto, K., Journal of Electronic Materials, Vol. 33, No. 11, (2004), pp. 1331-1337.
67. Moon, K. S., Wu, J. & Wong, C. P., IEEE Transactions on Components & Packaging Technologies, Vol. 26, No. 2, (2003), pp. 375-381.
68. Daoqiang, L. & Wong C-P., IEEE Transactions on Electronics Packaging Manufacturing, Vol. 23, No. 3 (2000), pp. 185-190.
69. Suzuki, K., Shirai, Y., Mizumura, N. & Konagata, M., Proc. 4th International Confer. Polymers & Adhesives in Microelectronics & Photonics, Portland, Oregon, (2004), MP3-1.
70. st Electronic Components and Technology Conference, Orlando, FL. (2001)
71. Moon, K. Wu, J. & Wong, C-P., Proc. International Symposium & Exhibition on Advanced Materials, Braselton, GA (2001), 341-346.
72. Fu, Y., Liu, J. & Willander, M., International Journal of Adhesion and Adhesives, Vol. 19, No.4, pp. 281-286.
73. Moon, K. S., Dong, H., Marie, R., Pothukuchi, S., Hunt, A., Li, Y. & Wong, C. P., Journal of Electronic Materials, Vol. 34, No. 2 (2005), pp. 168-175.
74. Ye, L., Lai, Z., Liu, J. & Thölén, A., IEEE Transactions on Electronics Packaging Manufactureing, Vol. 22, No. 4, (1999), pp. 299-302.
75. Li, L. & Morris, J., unpublished.
76. th IEEE CPMT Conference on High Design Microsystme Design & Packaging and Components Failure Analysis (HDP'04), Shanghai, (2004), pp 382-384.
77. st Electronic Components and Technology Conf, Orlando, FL, (2001).
78. nd Electronic Components and Technology Conf, San Diego, CA, (2002).
79. Liong, S., Wong, C. P. & Burgoyen, Jr. W. F., IEEE Transactions on Components & Packaging Technologies, Vol. 28, No. 2, (2005), pp. 327-336.
80. Li, H. & Wong, C. P., IEEE Transactions on Advanced Packaging, Vol. 27, No. 1 (2004), pp. 165-172.
81. Li, L. & Morris, J. E., Electrically Conductive Adhesives: A Comprehensive Review (J. Liu, editor), Electrochemical Press, UK, (1999) pp. 99-116.
82. Lu, D. & Wong, C. P., International Journal of Adhesion & Adhesives, Vol. 20, No. 3, (2000), pp. 189-193.
83. Daoqiang, L., Tong, Q. & Wong, C-P., IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 3 (1999), pp. 223-227.
84. Khoo, C., Liu, J., Agren, M. & Hjertberg, T., Proc. 1996 IEPS Conference, Austin, Texas, (1996), pp 483-501.
85. Liu, J., Gustafsson, K., Lai, Z. & Li, C., IEEE Trans-CPMT-A, Vol.20, No. 1, (1997), pp. 21-30.
86. Wu, S., Mei, Y., Yeh, C. & Wyatt, K., IEEE Transactions on Components, Packaging & Manufacturing Technology Part C. Vol. 19, No. 4 (1996), pp. 251-256.87.
87. Liu, J., Lundström, P., Gustafsson, K. & Lai, Z., EEP-Vol. 19-1 Advances in Electronics Packaging, Vol. 1 ASME (1997), pp. 193-199.
88. st Electronic Components and Technology Conference, Orlando, FL, (2001). pp. 593-597.
89. Fu, Y., Wang, T. & Liu, J., IEEE Transactions on Components and Packaging Technology Vol. 26, No, 1 (2003), pp. 193-198.
90. Mo, Z., Wang, X., Wang, T., Li, S., Lai, Z. & Liu, J., Journal of Electronic Materials, Vol. 31, No. 9, (2002), pp. 916-920.
91. th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Espoo, Finland, (2000), pp. 194-198.
92. Nysaether, J., Lai, Z. & Liu, J., IEEE Transactions on Advanced Packaging, Vol. 23, No. 4 (2000), pp. 743-749.
93. nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, (1996), pp. 141-153
94. Li, L., Morris, J. E., Liu, J., Lai, Z., Ljungkrona, L. & Li, C., Proc. 45th Electronic Components & Technol. Conference, Las Vegas, NV, (1995), pp. 114-120.
95. Botter, H., Van Der Plas, R. B. & Junai, A., International Journal of Microelectronic packaging, Vol. 1, No. (3), (1998), pp. 177-186.
96. th Electronic Components & Technology Conference, San Diego, (1999).
97. nd International Symposium Polymeric Electronics Packaging (PEP'99), Gothenburg, Sweden, (1999), pp. 1-8.
98. Lu, D., Tong, Q. & Wong, C-P., IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 3 (1999), pp. 228-232.
99. th Electronic Components & Technology Conference, San Diego, (1999).
100. Lu, D. & Wong, C. P., IEEE Transactions Components Packaging Technologies, Vol. 23, No. 4, (2000), pp. 620-626.
101. th International Symposium on Advanced Packaging Materials, Braselton, GA, (2002), pp. 139-143.
102. Lu, D. & Wong C. P., IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 4 (1999), pp. 324-330.
103. Lu, D. & Wong, C-P., IEEE Transactions on Components and Packaging Technologies, Vol. 23, No.3, (2000), pp. 440-446.
104. Khoo, C. & Liu, J., Circuit World, Vol.22, No.4, (1996), pp. 9-15.
105. Dudek, R., Berek, H., Fritsch, T. & Michel, B., IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3 (2000), pp. 462-469.
106. rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY, (1998), pp. 272-277.
107. th International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, Georgia, (1998).
108. Xu, S. & Dillard, D., IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3 (2003), pp. 554-562.
109. th International Symposium on Advanced Packaging Materials, Braselton, GA, (2002), pp. 226-231.
110. th International Symposium on Advanced Packaging Materials, Braselton, GA, (2002), pp. 144-150.
111. Kotthaus, S., Haug, R., Schäfer, H. & Hennemann, 0., IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2, (1998), pp. 259-265.
112. Sancaktar, E., Rajput, P. & Khanolkar, A., Proc. 4th International Confer. Polymers & Adhesives in Microelectronics & Photonics, Portland, Oregon, (2004), RT2-1.
113. Manepallis, R., Stepniak, F., Bidstrup-Allen, S. A. & Kohl, P., IEEE Transactions on Advanced Packaging, Vol. 22, No. 1 (1999), pp. 4-8.
114. Morris, J. E. & Das, J. H. in Electronics Packaging Forum, Vol. 3, J. E. Morris (ed.) IEEE Press (1994) 41-71.
115. Morris, J. E. & Das, J., IEEE Trans-CPMT-B: Advanced Packaging, Vol. 17, (1994), pp. 620-625.
116. Segerberg, T., "Life Cycle Analysis - A comparison between conductive adhesives and lead containing solder for surface mount application," IVF report, (1997).
117. Westphal, H., in Conductive Adhesives for Electronics Packaging, edited by Liu, J. Electrochemical Publications Ltd, UK, (1998), pp. 415-424.
118. Sancaktar, E. & Dilsiz, N., Adhesion, Journal of Science & Technology, Vol. 10, (1996).
119. rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY, (1998), pp. 156-159.
120. Vanfleteren, J., Vandecasteele, B. & Podprock, T., 4th Electronic Packaging Technology Conf, Singapore, (2002).