Study on self-alignment capability of Electrically Conductive Adhesives (ECAs) for flip-chip application

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 341-346

  Moon, K S ^a   Wu, J ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; EPOXY RESINS; FILLERS; FLIP CHIP DEVICES; SOLDERING ALLOYS; SURFACE TENSION; THERMAL EFFECTS;

ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);

ADHESIVES;

EID: 0035006683     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)