Fundamental study on adhesive strength of electrical conductive adhesives (ECAs)

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 156-159

  Inada, Teiichi ^a,b   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATINGS; ELECTRONICS PACKAGING; JOINING; PACKAGING MATERIALS; RANDOM PROCESSES; SILVER;

ADHESIVE STRENGTH; CONDUCTIVE PATHS; ELECTRICAL CONDUCTIVE ADHESIVES; ELECTRICAL CONTACTS; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC PACKAGING; FUNDAMENTAL STUDIES; GENERATION INTERCONNECTION;

CONDUCTIVE MATERIALS;

EID: 84904078626     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742019     Document Type: Conference Paper

References (3)

1. C. P. Wong, D. Lu, L. Meyers and Q. K. Tong, Fundamental Study of Electrical Conductive Adhesives (ECAs), IEEE Proceedings on Int. Sym. on Electronic Packaging p.80(1977)
2. C. P. Wong, "Recent Advances on E neap sul ants and Adhesives for Microelectronic packaging", Proceedings on Adhesives in Electronics, p. 250(1996)
3. J. Liu, L. Ljungkrona, Z. Lai, "Development of Conductive Adhesives Joining for Surface Mounting Electronics Manufacturing", IEEE Trans, on CPMT, Vol. 18, No. 2, 319(1995)