SCOPUS 정보 검색 플랫폼

Volumn 74, Issue 1-4, 2000, Pages 301-315

Copper-based conductive polymers: A new concept in conductive resins

Author keywords

Applications; Copper; Electrically conductive adhesive; Epoxy; Volume resistivity

Indexed keywords

ADHESIVES; COPPER; ELECTRIC FIELD EFFECTS; EPOXY RESINS; THERMOPLASTICS;

CONDUCTIVE POLYMERS;

CONDUCTIVE PLASTICS;

EID: 0034438357 PISSN: 00218464 EISSN: None Source Type: Journal
DOI: 10.1080/00218460008034533 Document Type: Article

Times cited : (16)

References (10)

1
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- Bolger, J.¹

2
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- Conductive inks and coatings
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- (1986) Adhesives for Industry Conference
- Bolger, J.¹ Astle, R.² Morano, S.³

3
- 0023433746
- The behavior of silver flakes in conductive epoxy adhesives
- October
- (1987) Adhesives Age , pp. 31-35
- Pandini, S.¹

4
- 0004827088
- US Patent No. 3,983,075, 28 September
- (1976) Copper Filled Conductive Epoxy
- Marshall, D.W.¹

5
- 33749560184
- (1973) Reviews of Modern Physics , vol.45 , pp. 574-588
- Kirkpatrick, S.¹

6
- 0004829495
- Shielding electronic components with conductive plastics
- November
- (1998) Machine Design , pp. 59-62
- Borgmans, C.¹ Gerteisen, S.²

7
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- AIME
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8
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- Development of electrical conduction in silver-filled epoxy adhesives
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- Lovinger, A.¹

9
- 0020302968
- An electrically conductive adhesive used in a food warming tray
- ANTEC 1982, May
- (1982) The 40th Annual Technical Conference and Exhibition of the Society of Plastics Engineers , vol.28
- Marshall, D.W.¹ Mack, A.²

10
- 0004830445
- Copper based conductive polymers, a new concept in conductive resins
- 16 November
- (1983) Proceedings 1983 NEPCON Central Meeting
- Marshall, D.W.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.