Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 462-469

  Dudek, Rainer ^a,b   Berek, Harry ^c   Fritsch, Thomas ^c   Michel, Bernd ^a,b  

^a IEEE

^b FRAUNHOFER GESELLSCHAFT   (Germany)

^c Research Institute for Nonferrous Metals   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; CONDUCTIVE PLASTICS; DIFFUSION; ELECTRIC CONDUCTIVITY OF SOLIDS; EPOXY RESINS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; MOISTURE DETERMINATION; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS; VISCOELASTICITY;

ISOTROPIC CONDUCTIVE ADHESIVES (ICA); MOISTURE DIFFUSION ANALYSIS;

ADHESIVE JOINTS;

EID: 0034276193     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868845     Document Type: Article

References (10)

1. L. Li, J. E. Morris, J. Liu, Z. Lai, L. Ljungkrona, and C. Li, "Reliability and failure mechanism of isotropically conductive adhesive joints," in Proc. 45th IEEE Electron. Comp. Conf., Las Vegas, NV, 1995.
2. J. Liu, "Use of adhesives for electronics packaging applications - The state of the art," in Proc. Int. Conf. Micromat'97, Berlin, Germany, 1997, pp. 76-83.
3. K. Suzuki, O. Suzuki, and M. Komagata, "Conductive adhesive materials for lead solder replacement," in Proc. 1st IEEE Int. Symp. Polymeric Electron. Packag., 1997, pp. 272-277.
4. Q. K. Tong, S. A. Vona, R. Kuder, and D. Shenfield, "The recent advances in surface mount conductive adhesives," in Proc. 3rd IEEE Int. Conf. Adhesives'98, Binghamton, NY, 1998, pp. 272-277.
5. D. Lu and C. P. Wong, "Mechanisms underlying the unstable contact resistance of conductive adhesives," in Proc. 49th IEEE Electron. Comp. Conf., San Diego, CA, 1999.
6. J. C. Jagt, P. J. M. Beris, and G. F. C. M. Lijten, "Electrically conductive adhesives: A prospective alternative for SMD soldering?," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 18, pp. 292-298, May 1995.
7. E. Sancaktar and N. Dilsiz, "Pressure dependent conductive behavior of various particles for conductive adhesive applications," in Proc. 3rd IEEE Int. Conf. Adhesives'98, Binghamton, NY, 1998, pp. 334-344.
8. ABAQUS Theory Manual (V. 5.7). Providence, RI: Hibbitt, Karlsson, and Sorensen, Inc., 1997.
9. R. Dudek, D. Vogel, and B. Michel, "Mechanical failure in COB-technology using glob-top encapsulation," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 19, pp. 232-240, Oct. 1996.
10. L. T. Nguyen, K. L. Chen, and J. Schaefer, "A new criterion for package integrity under solder reflow conditions," in Proc. 45th Electron. Comp. Technol. Conf., May. 1995, pp. 478-490.