Electrical conduction models for isotropically conductive adhesives

Journal of Electronics Manufacturing

Volumn 5, Issue 4, 1995, Pages 289-296

  Li, Li, ^a   Morris, J E ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; COMPOSITE MATERIALS; COMPUTER SIMULATION; CURING; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; HARDNESS; STRESSES;

CONSTRICTION RESISTANCE; ISOTROPICALLY CONDUCTIVE ADHESIVES; METALLIC CONTACT; MICROSCOPIC CONDUCTION; PARTICLE SIZE DISTRIBUTION; PERCOLATION THEORY; PERCOLATION THRESHOLD; RESISTOR NETWORK SIMULATIONS; TUNNELING RESISTANCE;

MATHEMATICAL MODELS;

EID: 0029456573     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S096031319500030X     Document Type: Article

References (9)