Electrical characterizations and considerations of electrically conductive adhesives (ECAs)

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 336-342

  Shimada, Yasushi ^a   Lu, Daoqiang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CURRENT DENSITY; ELECTRIC CONDUCTIVITY OF SOLIDS;

ELECTRICALLY CONDUCTIVE ADHESIVES; FOUR-POINT PROBE METHOD;

ELECTRONICS PACKAGING;

EID: 0033713932     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)