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Volumn 18, Issue 2, 1995, Pages 313-319
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Development of Conductive Adhesive Joining for Surface-Mounting Electronics Manufacturing
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Author keywords
[No Author keywords available]
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Indexed keywords
CONDUCTIVE ADHESIVE JOINING;
HUMIDITY TESTING;
OXIDE LAYER;
SURFACE MOUNTING ELECTRONICS MANUFACTURE;
SURFACE MOUNTING MACHINERY;
ADHESIVES;
ASSEMBLY;
CONDUCTIVE MATERIALS;
ELECTRIC MACHINERY;
ELECTRONIC EQUIPMENT MANUFACTURE;
OPTIMIZATION;
OXIDES;
SURFACE MOUNT TECHNOLOGY;
THERMAL CYCLING;
TRANSMISSION ELECTRON MICROSCOPY;
JOINING;
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EID: 0029305405
PISSN: 10709894
EISSN: None
Source Type: Journal
DOI: 10.1109/96.386267 Document Type: Article |
Times cited : (43)
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References (9)
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