Determining the Impact Resistance of Electrically Conductive Adhesives Using a Falling Wedge Test

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 554-562

  Xu, Shuangyan ^a   Dillard, David A ^b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b Princeton University   (United States)

Author keywords

Double cantilever beam; Electrically conductive adhesives; Falling wedge test; Fracture energy; Impact resistance; Loss factor; Viscoelastic energy

Indexed keywords

BONDING; CONDUCTIVE MATERIALS; IMPACT RESISTANCE; VISCOELASTICITY;

CONDUCTIVE ADHESIVES;

ADHESIVES;

EID: 0142165047     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817646     Document Type: Article

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